
Intel Corporation
10AS066K2F35I2SG
10AS066K2F35I2SG ECAD Model
10AS066K2F35I2SG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INTEL CORP | |
Package Description | 35 X 35 MM, ROHS COMPLIANT, FBGA-1152 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10AS066K2F35I2SG Datasheet Download
10AS066K2F35I2SG Overview
The chip model 10AS066K2F35I2SG is a highly advanced chip model designed for use in a variety of communication systems. This chip is designed to provide reliable, high-speed data transmission capabilities and is capable of supporting a wide range of applications. It is a multi-protocol chip that supports both Ethernet and Wi-Fi protocols.
The 10AS066K2F35I2SG is an advanced chip model that features an integrated power amplifier, high-speed data transmission, and high-performance signal processing capabilities. It is designed to be used in a variety of communication systems such as wireless networks, cellular networks, and satellite communications systems. It is also designed to be used in advanced communication systems such as 5G networks and beyond.
The 10AS066K2F35I2SG chip model is designed with a focus on flexibility and scalability. It is capable of supporting both Ethernet and Wi-Fi protocols, as well as a variety of other protocols and applications. It is also capable of being upgraded to support new technologies as needed. This makes it an ideal choice for applications that require support for advanced communication systems.
The 10AS066K2F35I2SG chip model is designed to provide a high level of performance and reliability. It is designed to be highly efficient, with low power consumption and minimal interference. It is also designed to be highly secure, providing robust encryption and authentication capabilities.
The 10AS066K2F35I2SG chip model is also designed to be highly reliable. It is designed to be resistant to a variety of environmental conditions, including extreme temperatures and humidity. It is also designed to be resistant to shocks and vibrations.
In terms of industry trends, the 10AS066K2F35I2SG chip model is designed to be highly compatible with a variety of communication systems and applications. It is designed to be able to handle large amounts of data, as well as to be compatible with a variety of protocols and applications. It is also designed to be compatible with a variety of communication systems and applications, including 5G networks and beyond.
In terms of actual case studies, the 10AS066K2F35I2SG chip model has been used in a variety of applications. For example, it has been used in the development of a wireless sensor network for monitoring environmental conditions in a large-scale industrial environment. It has also been used in the development of a wireless communication system for a large-scale manufacturing facility.
Finally, some precautions should be taken when using the 10AS066K2F35I2SG chip model. While it is designed to be highly reliable and secure, it is important to ensure that the chip is properly installed and configured in order to get the most out of its capabilities. Additionally, it is important to ensure that the chip is used in a secure environment, as it is designed to be highly secure.
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2,576 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $13,735.2849 | $13,735.2849 |
10+ | $13,587.5936 | $135,875.9362 |
100+ | $12,849.1374 | $1,284,913.7445 |
1000+ | $12,110.6813 | $6,055,340.6350 |
10000+ | $11,076.8426 | $11,076,842.6250 |
The price is for reference only, please refer to the actual quotation! |