Intel Corporation
10AS066H4F34E3SG
10AS066H4F34E3SG ECAD Model
10AS066H4F34E3SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 492 | |
| Number of Outputs | 492 | |
| Number of Logic Cells | 660000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.65 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel |
10AS066H4F34E3SG Overview
The chip model 10AS066H4F34E3SG has been designed to provide a reliable and efficient solution for advanced communication systems. It is a low-power, low-cost, and high-performance integrated circuit that meets the needs of today's communication networks. It is capable of providing a wide range of functions, such as data transmission, signal processing, and power management. It is also capable of providing a high degree of flexibility and scalability, enabling it to be used in a wide range of applications.
The original design intention of the chip model 10AS066H4F34E3SG was to provide a reliable and efficient solution for advanced communication systems. It has the potential to be used in future upgrades and applications, such as in networks and intelligent scenarios. It is capable of providing a wide range of functions, such as data transmission, signal processing, and power management. It is also capable of providing a high degree of flexibility and scalability, enabling it to be used in a wide range of applications.
The chip model 10AS066H4F34E3SG can be applied to the development and popularization of future intelligent robots. It is capable of providing a wide range of functions, such as data transmission, signal processing, and power management. It is also capable of providing a high degree of flexibility and scalability, enabling it to be used in a wide range of applications. To use the model effectively, technical talents such as engineers, software developers, and computer scientists are needed.
The chip model 10AS066H4F34E3SG has the potential to be used in the era of fully intelligent systems. It is capable of providing a wide range of functions, such as data transmission, signal processing, and power management. It is also capable of providing a high degree of flexibility and scalability, enabling it to be used in a wide range of applications. To use the model effectively, technical talents such as engineers, software developers, and computer scientists are needed. With its advanced features and capabilities, the chip model 10AS066H4F34E3SG has the potential to revolutionize the way we interact with intelligent systems in the future.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||