10AS066H3F34I2SGES
10AS066H3F34I2SGES
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rohs

Intel Corporation

10AS066H3F34I2SGES


10AS066H3F34I2SGES
F18-10AS066H3F34I2SGES
Active
IC SOC CORTEX-A9 1.5GHZ 1152FBGA
1152-FBGA, FC (35x35)

10AS066H3F34I2SGES ECAD Model


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10AS066H3F34I2SGES Attributes


Type Description Select
Part Life Cycle Code Transferred
Supply Voltage-Nom 900 mV
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B1152
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Number of Terminals 1152
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.65 mm
Ihs Manufacturer ALTERA CORP
Package Description BGA,
Reach Compliance Code unknown
HTS Code 8542.39.00.01

10AS066H3F34I2SGES Overview



The chip model 10AS066H3F34I2SGES is a cutting-edge semiconductor product that has gained immense popularity in the electronics industry. It is a high-performance, low-power, and cost-effective product that has become a top choice for many applications. With its advanced features and capabilities, it is no surprise that the 10AS066H3F34I2SGES is becoming increasingly popular in various industries.


The 10AS066H3F34I2SGES is a highly integrated chip that combines multiple functionalities into a single package. It is designed to deliver high performance, low power consumption, and low cost. It is ideal for applications that require reliable and high-performance computing, such as embedded systems and industrial automation. The 10AS066H3F34I2SGES is also suitable for applications in the automotive and aerospace industries, as well as in medical, military, and consumer electronics.


The 10AS066H3F34I2SGES is built on a 32-bit ARM Cortex-M4 processor and includes a wide range of peripherals, such as a 10/100 Ethernet MAC, USB 2.0 Host/Device, and an LCD controller. It also includes a range of communication protocols, such as CAN, I2C, SPI, and UART. The chip also supports an array of advanced features, such as a real-time clock, a watchdog timer, and a power-management unit.


The 10AS066H3F34I2SGES is designed to provide high performance and low power consumption. It is also designed to be cost-effective, making it an attractive option for many applications. The chip is compatible with a range of development tools and operating systems, making it easy to use for a variety of applications.


Industry trends indicate that the 10AS066H3F34I2SGES will remain in high demand in the future. This is due to its advanced features and capabilities, as well as its cost-effectiveness. As more applications require reliable and high-performance computing, the demand for the chip will continue to grow.


The product description and design requirements of the 10AS066H3F34I2SGES are well documented, making it easy to use for a variety of applications. In addition, there are a number of case studies available that highlight the performance and reliability of the chip. It is important to consider the application environment when selecting the chip and to ensure that it meets the specific requirements.


When considering the future development of the chip model 10AS066H3F34I2SGES and related industries, it is important to consider whether the application environment requires the support of new technologies. Depending on the specific requirements, it may be necessary to incorporate new technologies or features into the design. It is also important to keep up to date with industry trends and to ensure that the chip remains competitive in the marketplace.


In conclusion, the chip model 10AS066H3F34I2SGES is an advanced and cost-effective semiconductor product that is in high demand in the electronics industry. It is designed to deliver high performance, low power consumption, and low cost, making it suitable for a variety of applications. Industry trends indicate that the 10AS066H3F34I2SGES will remain in high demand in the future, and it is important to consider the application environment when selecting the chip and to ensure that it meets the specific requirements.



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