Intel Corporation
10AS066H2F34I2SGES
10AS066H2F34I2SGES ECAD Model
10AS066H2F34I2SGES Attributes
| Type | Description | Select |
|---|---|---|
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 900 mV | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.65 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | BGA, | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
10AS066H2F34I2SGES Overview
The chip model 10AS066H2F34I2SGES is a high-performance digital signal processor (DSP) designed to meet the needs of modern embedded systems. It is suitable for a wide range of applications, including high-performance digital signal processing, embedded processing, image processing, and more. Its design is based on the HDL language, which provides the flexibility and scalability necessary for the device to meet the demands of the modern world.
The chip model 10AS066H2F34I2SGES has many advantages that make it an attractive choice for embedded systems. Its high-performance architecture allows it to handle complex tasks quickly and efficiently, while its low power consumption makes it an ideal choice for energy-sensitive applications. It also supports a wide range of communication protocols, allowing it to be used in a variety of applications.
The demand for the chip model 10AS066H2F34I2SGES is expected to grow in the future. With its high performance and low power consumption, it is a great choice for a wide range of applications, from consumer electronics to industrial applications. As the demand for embedded systems continues to grow, the chip model 10AS066H2F34I2SGES is well-positioned to meet the needs of the market.
The original design intention of the chip model 10AS066H2F34I2SGES was to provide a high-performance, low-power solution for embedded systems. Its flexible design allows it to be used in a wide range of applications, while its scalability and support for a variety of communication protocols make it a great choice for modern embedded systems. Furthermore, its design allows for future upgrades and enhancements, making it a great choice for applications that require advanced communication systems. With its high performance and low power consumption, the chip model 10AS066H2F34I2SGES is an ideal choice for modern embedded systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||