Intel Corporation
10AS057H2F34E2SG
10AS057H2F34E2SG ECAD Model
10AS057H2F34E2SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 492 | |
| Number of Outputs | 492 | |
| Number of Logic Cells | 570000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.65 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AS057H2F34E2SG Overview
The chip model 10AS057H2F34E2SG has become increasingly popular in recent years and is widely used in many industries. This chip model is a highly integrated, low-power, high-performance system-on-chip (SoC) designed for advanced communication systems. It is based on a 32-bit ARM Cortex-A7 processor core, and supports multiple peripherals, including Ethernet, USB, CAN, and SDIO.
The 10AS057H2F34E2SG chip model has many advantages, such as low power consumption and high performance, making it suitable for a wide range of applications. It has a wide operating temperature range and can operate in extreme temperature environments. It also has built-in safety features, such as ECC memory protection, which can help protect data from corruption. Furthermore, this chip model has a low cost and is easy to use, making it an attractive option for many industries.
In terms of industry trends, the 10AS057H2F34E2SG chip model is expected to remain popular in the future due to its low power consumption, high performance, and low cost. It is expected to be used in a wide variety of applications, such as industrial automation, automotive, and medical. Additionally, the chip model is likely to be used in the development of advanced communication systems, such as 5G networks and the Internet of Things (IoT).
In terms of the original design intention of the chip model 10AS057H2F34E2SG, it was designed to be a highly integrated, low-power, high-performance system-on-chip (SoC) for advanced communication systems. It is capable of supporting multiple peripherals, including Ethernet, USB, CAN, and SDIO, making it suitable for a wide variety of applications.
In terms of future upgrades, the 10AS057H2F34E2SG chip model is capable of being upgraded with new technologies in order to meet the changing needs of the application environment. For example, it can be upgraded with new peripherals, such as CAN-FD, or with new software, such as the Linux operating system. Additionally, the chip model can be upgraded with new features, such as advanced security features, to ensure data protection.
Overall, the chip model 10AS057H2F34E2SG is a highly integrated, low-power, high-performance system-on-chip (SoC) designed for advanced communication systems. It has many advantages, such as low power consumption and high performance, and is expected to remain popular in the future due to its low cost and ease of use. Furthermore, it is capable of being upgraded with new technologies in order to meet the changing needs of the application environment.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||