
Intel Corporation
10AS048K4F35E3SG
10AS048K4F35E3SG ECAD Model
10AS048K4F35E3SG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INTEL CORP | |
Package Description | 35 X 35 MM, ROHS COMPLIANT, FBGA-1152 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10AS048K4F35E3SG Datasheet Download
10AS048K4F35E3SG Overview
The chip model 10AS048K4F35E3SG is a highly advanced semiconductor device that is designed to provide a wide range of features and functions for various applications. It is a versatile and reliable device that can be used in a variety of industries. This chip model is a great choice for those looking for a reliable and cost-effective solution.
The 10AS048K4F35E3SG chip model is designed to provide a wide range of features and functions, including high-speed signal processing, data storage, and power management. It is also designed to be compatible with a wide range of communication systems. This chip model also offers a wide range of options for customization and is designed to be highly efficient and reliable.
The 10AS048K4F35E3SG chip model is designed to provide a wide range of features and functions that are ideal for a variety of industries, including telecommunications, automotive, aerospace, and medical. This chip model is designed to be highly reliable and efficient, which makes it ideal for a variety of applications. Additionally, this chip model is designed to be cost-effective and is designed to be compatible with a wide range of communication systems.
The 10AS048K4F35E3SG chip model is expected to be in high demand in the future due to its wide range of features and functions. This chip model is designed to be highly reliable and efficient, which makes it ideal for a variety of applications. Additionally, this chip model is designed to be cost-effective and is designed to be compatible with a wide range of communication systems. This makes it an ideal choice for those looking for a reliable and cost-effective solution.
The original design intention of the 10AS048K4F35E3SG chip model is to provide a wide range of features and functions that are ideal for a variety of industries. This chip model is designed to be highly reliable and efficient, which makes it ideal for a variety of applications. Additionally, this chip model is designed to be cost-effective and is designed to be compatible with a wide range of communication systems.
The 10AS048K4F35E3SG chip model is designed to be highly reliable and efficient, which makes it ideal for a variety of applications. Additionally, this chip model is designed to be cost-effective and is designed to be compatible with a wide range of communication systems. This makes it an ideal choice for those looking for a reliable and cost-effective solution. As such, this chip model is expected to be in high demand in the future due to its wide range of features and functions.
The product description and specific design requirements of the 10AS048K4F35E3SG chip model include a wide range of features and functions, such as high-speed signal processing, data storage, and power management. This chip model is also designed to be compatible with a wide range of communication systems. Additionally, this chip model is designed to be highly reliable and efficient, which makes it ideal for a variety of applications.
The 10AS048K4F35E3SG chip model is designed with the possibility of future upgrades in mind. This chip model is designed to be highly reliable and efficient, which makes it ideal for a variety of applications. Additionally, this chip model is designed to be cost-effective and is designed to be compatible with a wide range of communication systems. As such, this chip model is designed with the possibility of future upgrades in mind, which makes it an ideal choice for those looking for a reliable and cost-effective solution.
Actual case studies and precautions should be taken when using the 10AS048K4F35E3SG chip model. This chip model is designed to be highly reliable and efficient, which makes it ideal for a variety of applications. Additionally, this chip model is designed to be cost-effective and is designed to be compatible with a wide range of communication systems. As such, it is important to understand the specific design requirements of the chip model and to ensure that it is used in accordance with those requirements. Additionally, it is important to understand the possible implications of any upgrades or modifications that may be made to the chip model.
In conclusion, the 10AS048K4F35E3SG chip model is a highly advanced semiconductor device that is designed to provide a wide range of features and functions for various applications. It is expected to be in high demand in the future due to its wide range of features and functions. Additionally, this chip model is designed to be highly reliable and efficient, which makes it ideal for a variety of applications. Finally, it is important to understand the specific design requirements of the chip model and to ensure that it is used in accordance with those requirements, as well as the possible implications of any upgrades or modifications that may be made to the chip model.
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3,543 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $1,531.1569 | $1,531.1569 |
10+ | $1,514.6929 | $15,146.9288 |
100+ | $1,432.3726 | $143,237.2611 |
1000+ | $1,350.0523 | $675,026.1730 |
10000+ | $1,234.8040 | $1,234,803.9750 |
The price is for reference only, please refer to the actual quotation! |