Intel Corporation
10AS032H4F35I3LG
10AS032H4F35I3LG ECAD Model
10AS032H4F35I3LG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 384 | |
| Number of Outputs | 384 | |
| Number of Logic Cells | 320000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AS032H4F35I3LG Overview
Chip model 10AS032H4F35I3LG is a product of the semiconductor industry, which is a key component of the current digital economy. It is a 32-bit microcontroller with a 32-bit RISC CPU core and a wide range of integrated peripherals, designed to provide a flexible and cost-effective solution for embedded applications. The chip model 10AS032H4F35I3LG is an ideal choice for applications such as motor control, automotive, industrial, consumer and medical.
In terms of industry trends, the chip model 10AS032H4F35I3LG has been widely adopted for its high performance and low power consumption. It supports a variety of communication protocols, including Ethernet, CAN and USB, and is capable of supporting a variety of applications. In addition, the chip model 10AS032H4F35I3LG is also capable of supporting advanced communication systems, such as LTE, 5G and Wi-Fi 6.
In terms of future development, the chip model 10AS032H4F35I3LG is expected to be used in more advanced applications, such as in networks and intelligent systems. It is expected to be used in the era of fully intelligent systems, where it can be used to provide the computing power needed for AI and machine learning applications. Moreover, the chip model 10AS032H4F35I3LG is expected to be upgraded to support new technologies, such as low-power wide-area networks (LPWANs), to enable the development of new applications.
In conclusion, the chip model 10AS032H4F35I3LG is a highly versatile and cost-effective solution for embedded applications, capable of supporting a variety of communication protocols and advanced communication systems. It is expected to be used in more advanced applications in the future, and may be upgraded to support new technologies. The chip model 10AS032H4F35I3LG is an ideal choice for applications such as motor control, automotive, industrial, consumer and medical, and is expected to play an important role in the development of intelligent systems in the future.
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3,690 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $5,377.0571 | $5,377.0571 |
| 10+ | $5,319.2393 | $53,192.3926 |
| 100+ | $5,030.1502 | $503,015.0166 |
| 1000+ | $4,741.0611 | $2,370,530.5380 |
| 10000+ | $4,336.3364 | $4,336,336.3500 |
| The price is for reference only, please refer to the actual quotation! | ||