10AS032H4F34I3SG
10AS032H4F34I3SG
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

10AS032H4F34I3SG


10AS032H4F34I3SG
F18-10AS032H4F34I3SG
Active
35 X 35 MM, ROHS COMPLIANT, FBGA-1152
35 X 35 MM, ROHS COMPLIANT, FBGA-1152

10AS032H4F34I3SG ECAD Model


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10AS032H4F34I3SG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer INTEL CORP
Package Description 35 X 35 MM, ROHS COMPLIANT, FBGA-1152
Reach Compliance Code compliant
HTS Code 8542.39.00.01
ECCN Code 3A991

10AS032H4F34I3SG Datasheet Download


10AS032H4F34I3SG Overview



The chip model 10AS032H4F34I3SG is an advanced integrated circuit designed for high-performance digital signal processing, embedded processing, image processing, and other applications. This chip is designed to be used with the HDL language and is capable of being upgraded for future use.


The 10AS032H4F34I3SG is a highly versatile chip that offers a variety of features for different applications. It is capable of handling high-speed data processing, image processing, and other digital signal processing tasks. It also has an integrated memory controller, allowing for efficient data storage and retrieval. In addition, it has an on-chip clock generator, allowing for a wide range of clock frequencies.


The 10AS032H4F34I3SG is also suitable for advanced communication systems. It has the capability to handle high-speed data transmission, providing the necessary bandwidth for advanced communication protocols. It also has a low-power consumption, making it suitable for long-term use.


The 10AS032H4F34I3SG is a highly reliable chip that is designed for long-term use. It is also designed to be robust and resilient to environmental factors, such as temperature, humidity, and dust. Additionally, it is designed to be resistant to electromagnetic interference, making it suitable for use in harsh environments.


When designing with the 10AS032H4F34I3SG, it is important to consider the specific design requirements. This includes the necessary power supply, the clock frequency, the memory size, the data bus width, and other factors. Additionally, it is important to consider the actual usage scenarios and any potential problems that may arise.


Case studies and precautions should also be taken into consideration when designing with the 10AS032H4F34I3SG. In particular, it is important to be aware of any potential risks or issues that may arise with the use of the chip. Additionally, it is important to consider any potential upgrades that may be necessary in the future.


Overall, the 10AS032H4F34I3SG is an advanced integrated circuit designed for high-performance digital signal processing, embedded processing, image processing, and other applications. It is designed to be used with the HDL language and is capable of being upgraded for future use. It is also suitable for advanced communication systems, offering the necessary bandwidth for data transmission. When designing with the 10AS032H4F34I3SG, it is important to consider the specific design requirements, actual usage scenarios, and any potential risks or issues that may arise. Case studies and precautions should also be taken into consideration to ensure the successful use of the chip.



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Unit Price: $4,625.7343
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Pricing (USD)

QTY Unit Price Ext Price
1+ $4,301.9329 $4,301.9329
10+ $4,255.6756 $42,556.7556
100+ $4,024.3888 $402,438.8841
1000+ $3,793.1021 $1,896,551.0630
10000+ $3,469.3007 $3,469,300.7250
The price is for reference only, please refer to the actual quotation!

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