Intel Corporation
10AS032H4F34E3SG
10AS032H4F34E3SG ECAD Model
10AS032H4F34E3SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 384 | |
| Number of Outputs | 384 | |
| Number of Logic Cells | 320000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.65 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AS032H4F34E3SG Overview
The chip model 10AS032H4F34E3SG is a high-performance chip designed for digital signal processing, embedded processing, and image processing. It is based on the latest technology and provides excellent performance in these applications. The chip model is designed to be used with HDL language, which is a powerful and versatile language for designing and programming digital systems.
The chip model 10AS032H4F34E3SG is suitable for a wide range of applications, such as digital signal processing, embedded processing, and image processing. Its main features include high-speed data processing, low power consumption, and low latency. It is also suitable for applications that require high-performance computing and high-resolution image processing. The chip model is also suitable for applications that require the use of advanced algorithms and techniques.
The chip model 10AS032H4F34E3SG is designed to meet the latest industry trends and future development of related industries. It is designed to be compatible with the latest technologies and can be used in a variety of applications. It is also designed to be compatible with the latest standards and protocols, such as the IEEE 802.11ac standard.
The product description and specific design requirements of the chip model 10AS032H4F34E3SG are detailed in the product documentation. The product documentation also includes actual case studies and precautions to be taken while using the chip model. It is important to read the product documentation carefully before using the chip model to ensure that it is used correctly and safely.
The chip model 10AS032H4F34E3SG is an excellent choice for applications that require high-performance digital signal processing, embedded processing, and image processing. It is designed to be compatible with the latest technologies and standards, and its product documentation provides detailed information on its design requirements and actual case studies. It is important to read the product documentation carefully before using the chip model to ensure that it is used correctly and safely.
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1,379 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $3,583.5947 | $3,583.5947 |
| 10+ | $3,545.0614 | $35,450.6139 |
| 100+ | $3,352.3950 | $335,239.5012 |
| 1000+ | $3,159.7286 | $1,579,864.3160 |
| 10000+ | $2,889.9957 | $2,889,995.7000 |
| The price is for reference only, please refer to the actual quotation! | ||