Intel Corporation
10AS032H3F34E2SG
10AS032H3F34E2SG ECAD Model
10AS032H3F34E2SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 384 | |
| Number of Outputs | 384 | |
| Number of Logic Cells | 320000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.65 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AS032H3F34E2SG Overview
The chip model 10AS032H3F34E2SG is a cutting-edge technology in the semiconductor industry. It is a 32-bit microcontroller with a 32-bit RISC-V core and a wide range of peripherals, including a 10/100 Mbps Ethernet controller, two USB 2.0 ports, and a CAN bus. This chip model is designed to provide high performance, low power consumption, and low cost for a variety of embedded applications.
In terms of industry trends, the chip model 10AS032H3F34E2SG is currently being used in a variety of applications, including industrial control, automotive, medical, and consumer electronics. As the semiconductor industry continues to evolve, the chip model 10AS032H3F34E2SG is expected to be used in more advanced applications, such as communication systems and networks.
The original design intention of the chip model 10AS032H3F34E2SG was to provide a low-cost, low-power solution for embedded applications. Its future upgrades are expected to include additional peripherals and improved performance, as well as the addition of new technologies to support its application environment. This could include support for advanced communication protocols, such as 5G and Wi-Fi 6, as well as support for AI and machine learning.
In terms of applications, the chip model 10AS032H3F34E2SG could be used in networks to provide high-speed data transmission and low-latency communication. It could also be used in intelligent scenarios, such as smart homes and industrial automation, to enable the development of more advanced applications. In the era of fully intelligent systems, the chip model 10AS032H3F34E2SG could be used to support the development of AI-driven applications, such as autonomous vehicles and smart cities.
Overall, the chip model 10AS032H3F34E2SG is a powerful and versatile chip that is capable of handling a variety of embedded applications. Its future upgrades and applications are expected to continue to expand, providing support for new technologies and intelligent scenarios. This chip model is a great solution for those looking for a low-cost, low-power solution for their embedded applications.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||