10AS032H1F35I1SG
10AS032H1F35I1SG
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rohs

Intel Corporation

10AS032H1F35I1SG


10AS032H1F35I1SG
F18-10AS032H1F35I1SG
Active
IC SOC CORTEX-A9 1.5GHZ 1152FBGA
1152-FBGA, FC (35x35)

10AS032H1F35I1SG ECAD Model


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10AS032H1F35I1SG Attributes


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10AS032H1F35I1SG Overview



The chip model 10AS032H1F35I1SG is a high-performance integrated circuit designed for a variety of applications, such as high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL (hardware description language) which is a programming language used for describing digital systems. The chip model 10AS032H1F35I1SG has many advantages that make it an ideal choice for such applications.


First, the chip model 10AS032H1F35I1SG is designed to be highly efficient. It has a low power consumption and is designed to be run at high clock speeds while still maintaining a low power consumption. This makes the chip model 10AS032H1F35I1SG an ideal choice for applications that require high-performance digital signal processing. Additionally, the chip model 10AS032H1F35I1SG is designed to be highly reliable. It is designed to withstand extreme temperatures and other environmental conditions without compromising its performance.


The chip model 10AS032H1F35I1SG is also designed to be highly configurable. It can be easily customized to meet the specific needs of any application. This makes the chip model 10AS032H1F35I1SG an ideal choice for applications that require the ability to be easily modified and upgraded.


The demand for the chip model 10AS032H1F35I1SG is expected to increase in the future as more applications require high-performance digital signal processing. Additionally, the chip model 10AS032H1F35I1SG is expected to be used in advanced communication systems. This is due to its ability to be easily customized and upgraded.


The original design intention of the chip model 10AS032H1F35I1SG was to provide a highly efficient, reliable, and configurable solution for applications that require high-performance digital signal processing. The chip model 10AS032H1F35I1SG is designed to be highly reliable and is designed to withstand extreme temperatures and other environmental conditions without compromising its performance. Additionally, the chip model 10AS032H1F35I1SG is designed to be highly configurable, making it an ideal choice for applications that require the ability to be easily modified and upgraded.


The chip model 10AS032H1F35I1SG is also designed to be easily upgradable. This allows for future upgrades and improvements to the chip model 10AS032H1F35I1SG. This makes the chip model 10AS032H1F35I1SG an ideal choice for applications that require the ability to be easily modified and upgraded. Additionally, the chip model 10AS032H1F35I1SG is designed to be able to be used in advanced communication systems. This makes the chip model 10AS032H1F35I1SG an ideal choice for applications that require the ability to be used in advanced communication systems.


In conclusion, the chip model 10AS032H1F35I1SG is an ideal choice for applications that require high-performance digital signal processing, embedded processing, and image processing. It is designed to be highly efficient, reliable, and configurable. Additionally, the chip model 10AS032H1F35I1SG is designed to be easily upgradable and is expected to be used in advanced communication systems in the future.



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