10AS027H2F35E2LG
10AS027H2F35E2LG
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

10AS027H2F35E2LG


10AS027H2F35E2LG
F18-10AS027H2F35E2LG
Active
35 X 35 MM, ROHS COMPLIANT, FBGA-1152
35 X 35 MM, ROHS COMPLIANT, FBGA-1152

10AS027H2F35E2LG ECAD Model


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10AS027H2F35E2LG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer INTEL CORP
Package Description 35 X 35 MM, ROHS COMPLIANT, FBGA-1152
Reach Compliance Code compliant
HTS Code 8542.39.00.01
ECCN Code 3A991

10AS027H2F35E2LG Datasheet Download


10AS027H2F35E2LG Overview



The chip model 10AS027H2F35E2LG is a highly advanced semiconductor device that has been developed by a leading technology provider for use in a variety of applications. This model is designed to provide a high level of performance and reliability in a wide range of environments. It is capable of providing a wide range of features, such as high speed, low power consumption, and low cost. It is also designed to be compatible with a variety of operating systems and applications, making it an ideal choice for a wide range of applications.


The chip model 10AS027H2F35E2LG is a versatile and powerful device that is suitable for a wide range of applications. It is capable of providing a high level of performance and reliability in a wide range of environments, including commercial, industrial, and automotive applications. It is also capable of providing a wide range of features, such as high speed, low power consumption, and low cost. This makes it an ideal choice for a wide range of applications.


The chip model 10AS027H2F35E2LG has been designed to be highly reliable and efficient. It is capable of providing a wide range of features, such as high speed, low power consumption, and low cost. This makes it an ideal choice for a wide range of applications. It is also designed to be compatible with a variety of operating systems and applications, making it an ideal choice for a wide range of applications.


The chip model 10AS027H2F35E2LG has been designed to provide a wide range of features, such as high speed, low power consumption, and low cost. This makes it an ideal choice for a wide range of applications. It is also designed to be compatible with a variety of operating systems and applications, making it an ideal choice for a wide range of applications.


The chip model 10AS027H2F35E2LG is expected to be highly in demand in the future. As technology advances, the demand for this model is expected to increase, as it is a highly reliable and efficient device. The chip model is also expected to be used in a variety of applications, such as automotive, industrial, and commercial applications. It is also expected to be used in a wide range of applications, such as medical, communication, and entertainment applications.


The product description and specific design requirements of the chip model 10AS027H2F35E2LG are highly detailed and specific. It is important to be aware of the various design requirements and specifications of the model, as they are essential for ensuring that the device works properly and efficiently. It is also important to be aware of the various precautions and safety measures that must be taken when using the device.


In order to determine whether the application environment requires the support of new technologies, it is important to consider the specific requirements of the application. Depending on the application and the specific requirements, it may be necessary to use new technologies in order to ensure that the device works properly and efficiently. It is also important to consider any potential risks or hazards that may be associated with the use of the device.


Overall, the chip model 10AS027H2F35E2LG is a highly advanced semiconductor device that is suitable for a wide range of applications. It is capable of providing a wide range of features, such as high speed, low power consumption, and low cost. It is also designed to be compatible with a variety of operating systems and applications, making it an ideal choice for a wide range of applications. The chip model is expected to be highly in demand in the future, as technology advances and the demand for this model increases. It is also important to be aware of the product description and the specific design requirements of the chip model, as well as any potential risks or hazards associated with the use of the device.



3,516 In Stock


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Unit Price: $5,904.8236
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $5,491.4859 $5,491.4859
10+ $5,432.4377 $54,324.3771
100+ $5,137.1965 $513,719.6532
1000+ $4,841.9554 $2,420,977.6760
10000+ $4,428.6177 $4,428,617.7000
The price is for reference only, please refer to the actual quotation!

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