Intel Corporation
10AS027H1F35I1SG
10AS027H1F35I1SG ECAD Model
10AS027H1F35I1SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 900 mV | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | 35 X 35 MM, ROHS COMPLIANT, FBGA-1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AS027H1F35I1SG Overview
The chip model 10AS027H1F35I1SG is a high-performance, low-power SoC that is designed to support a range of applications. It is a versatile, multi-core processor with integrated hardware acceleration, making it suitable for a wide range of applications. This chip model is designed to provide a high level of performance, reliability, and scalability to meet the needs of today's ever-evolving technology landscape.
The 10AS027H1F35I1SG chip model is designed to provide a wide range of features and benefits, including high-speed data processing, low-power consumption, and a wide range of peripheral interfaces. It is also designed to be easily upgradable to support the latest technologies and applications. This chip model is designed to support a wide range of communication protocols, such as Wi-Fi, Bluetooth, and Zigbee. It is also designed to support a wide range of sensors, such as accelerometers, gyroscopes, and pressure sensors.
The 10AS027H1F35I1SG chip model is designed to provide a wide range of features and benefits that make it suitable for a variety of applications. It is designed to be highly reliable and to provide high-performance data processing. It is also designed to be easily upgradable to support the latest technologies and applications. This chip model is designed to support a wide range of communication protocols, such as Wi-Fi, Bluetooth, and Zigbee. It is also designed to support a wide range of sensors, such as accelerometers, gyroscopes, and pressure sensors.
The 10AS027H1F35I1SG chip model is expected to be in high demand in the future due to its versatile features and benefits. It is expected to be used in a variety of applications, such as smart home and industrial automation systems. It is also expected to be used in advanced communication systems, such as 5G networks and satellite communication systems.
The original design intention of the 10AS027H1F35I1SG chip model was to provide a high level of performance, reliability, and scalability to meet the needs of today's ever-evolving technology landscape. The chip model was designed with the flexibility to be easily upgradable to support the latest technologies and applications. This chip model is designed to support a wide range of communication protocols, such as Wi-Fi, Bluetooth, and Zigbee. It is also designed to support a wide range of sensors, such as accelerometers, gyroscopes, and pressure sensors.
The 10AS027H1F35I1SG chip model is expected to be in high demand in the future due to its versatile features and benefits. It is expected to be used in a variety of applications, such as smart home and industrial automation systems. It is also expected to be used in advanced communication systems, such as 5G networks and satellite communication systems. The chip model is designed to be easily upgradable to support the latest technologies and applications. Its flexibility and scalability make it a suitable candidate for future upgrades.
In conclusion, the 10AS027H1F35I1SG chip model is a versatile, multi-core processor with integrated hardware acceleration, making it suitable for a wide range of applications. It is designed to provide a high level of performance, reliability, and scalability to meet the needs of today's ever-evolving technology landscape. The chip model is expected to be in high demand in the future due to its versatile features and benefits. It is also designed to be easily upgradable to support the latest technologies and applications, making it a suitable candidate for future upgrades.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||