10AS027H1F34I1SG
10AS027H1F34I1SG
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

10AS027H1F34I1SG


10AS027H1F34I1SG
F18-10AS027H1F34I1SG
Active
IC SOC CORTEX-A9 1.5GHZ 1152FBGA
1152-FBGA, FC (35x35)

10AS027H1F34I1SG ECAD Model


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10AS027H1F34I1SG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Transferred
Supply Voltage-Nom 900 mV
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B1152
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Number of Terminals 1152
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.65 mm
Ihs Manufacturer ALTERA CORP
Package Description 35 X 35 MM, ROHS COMPLIANT, FBGA-1152
Reach Compliance Code compliant
HTS Code 8542.39.00.01

10AS027H1F34I1SG Overview



The chip model 10AS027H1F34I1SG is a powerful and versatile processor that has been gaining traction in the industry due to its many advantages. It is a highly efficient processor that can be used in a variety of applications, from embedded systems to advanced communication systems. The model is designed with a number of features that make it uniquely suited for use in a wide range of applications.


The 10AS027H1F34I1SG chip model is designed with a number of features that make it well-suited for use in today's advanced communication systems. It features a high-speed, low-power processor with a wide range of memory and I/O options. It also has a wide range of peripherals, including USB, Ethernet, and Wi-Fi. Additionally, the chip model has a number of advanced features that make it suitable for use in a variety of applications, including signal processing, image processing, and more.


The 10AS027H1F34I1SG chip model is also designed with the potential for future upgrades. It is designed with a modular architecture that allows for easy upgrades and expansion. This makes it possible to add new features and capabilities as needed, allowing the chip model to keep up with the ever-evolving communication systems. Additionally, the chip model is designed with a number of features that make it suitable for use in a variety of applications, including embedded systems, as well as advanced communication systems.


The chip model 10AS027H1F34I1SG is also designed with the possibility of future applications in networks and intelligent scenarios. It is designed with features that make it suitable for use in a variety of intelligent scenarios, including artificial intelligence, machine learning, and more. Additionally, the chip model is designed to be able to be used in the era of fully intelligent systems, allowing it to be used in a variety of scenarios that require a high level of intelligence.


The 10AS027H1F34I1SG chip model is quickly becoming a popular choice in the industry due to its many advantages. It is a highly efficient processor that can be used in a variety of applications, from embedded systems to advanced communication systems. Additionally, it is designed with the potential for future upgrades and expansion, making it suitable for use in a variety of intelligent scenarios. As the demand for more advanced communication systems continues to grow, the 10AS027H1F34I1SG chip model is likely to become even more popular in the industry.



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