10AS027E4F27I3SG
10AS027E4F27I3SG
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

10AS027E4F27I3SG


10AS027E4F27I3SG
F18-10AS027E4F27I3SG
Active
27 X 27 MM, ROHS COMPLIANT, FBGA-672
27 X 27 MM, ROHS COMPLIANT, FBGA-672

10AS027E4F27I3SG ECAD Model


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10AS027E4F27I3SG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer INTEL CORP
Package Description 27 X 27 MM, ROHS COMPLIANT, FBGA-672
Reach Compliance Code compliant
ECCN Code 3A991
HTS Code 8542.39.00.01

10AS027E4F27I3SG Datasheet Download


10AS027E4F27I3SG Overview



The chip model 10AS027E4F27I3SG is an integrated circuit designed for high-performance digital signal processing, embedded processing, image processing, and other applications. It is designed to be used with the hardware description language (HDL) to provide powerful and efficient processing capabilities.


The 10AS027E4F27I3SG has been designed with the intention of providing a high level of performance and scalability. It is capable of handling large amounts of data and can be used for a variety of applications. It is also designed to be easily upgradable, meaning that it can be used in advanced communication systems with minimal modifications.


The 10AS027E4F27I3SG is designed to be highly configurable and customizable. It has a variety of features that allow users to tailor the chip to their specific requirements. It has an integrated clock generator, a wide range of I/O options, and a number of advanced features such as pipelining, memory protection, and error correction.


The 10AS027E4F27I3SG is a powerful and reliable chip that can be used for a variety of applications. It is important to understand the product description and specific design requirements of the chip before using it, as this will ensure that it is used correctly and safely. To this end, there are a number of case studies and tutorials available to help users understand the chip and its features.


In addition, there are a number of precautions that should be taken when using the 10AS027E4F27I3SG. It is important to ensure that the chip is properly cooled and kept at the correct temperature, as overheating can cause the chip to malfunction. It is also important to ensure that the chip is properly connected to the system, as incorrect connections can lead to poor performance and instability.


The chip model 10AS027E4F27I3SG is a powerful and reliable integrated circuit designed for high-performance digital signal processing, embedded processing, image processing, and other applications. It is capable of handling large amounts of data and can be used for a variety of applications. It is important to understand the product description and design requirements of the chip before using it, as this will ensure that it is used correctly and safely. With the right knowledge and precautions in place, the 10AS027E4F27I3SG can be an invaluable tool for advanced communication systems.



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Unit Price: $659.2027
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Pricing (USD)

QTY Unit Price Ext Price
1+ $613.0585 $613.0585
10+ $606.4665 $6,064.6648
100+ $573.5063 $57,350.6349
1000+ $540.5462 $270,273.1070
10000+ $494.4020 $494,402.0250
The price is for reference only, please refer to the actual quotation!

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