
Intel Corporation
10AS027E3F27I2LG
10AS027E3F27I2LG ECAD Model
10AS027E3F27I2LG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INTEL CORP | |
Package Description | 27 X 27 MM, ROHS COMPLIANT, FBGA-672 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A991 |
10AS027E3F27I2LG Datasheet Download
10AS027E3F27I2LG Overview
The chip model 10AS027E3F27I2LG is a new model of integrated circuit chip developed by the leading semiconductor company, XYZ Corporation. It is designed to provide superior performance in a wide range of applications, from consumer electronics to industrial automation. This chip model is designed to be highly reliable, efficient, and cost-effective, and can be used in a variety of applications.
The chip model 10AS027E3F27I2LG has several advantages over other models. It has a higher processing speed, which makes it ideal for a variety of applications. It also has a low power consumption, which means it can be used in a wide range of applications without having to worry about power consumption. In addition, it has a wide range of features and functions, including high-speed data transfer, advanced security features, and a wide range of communication protocols.
The chip model 10AS027E3F27I2LG is expected to experience an increasing demand in the near future, as it is increasingly being used in a variety of applications. It is expected to be used in industrial automation, medical devices, and consumer electronics. It is also expected to be used in advanced communication systems, such as 5G networks and satellite communication systems.
The original design intention of the chip model 10AS027E3F27I2LG was to provide superior performance and reliability, while also being cost-effective. It is designed to be highly efficient and reliable, and is expected to be able to handle a wide range of applications. It is also designed to be easily upgradeable, so that it can keep up with the latest technologies and advancements.
The chip model 10AS027E3F27I2LG has the potential to be used in a variety of applications in the future. It could be used in networks for data transfer, communication protocols, and security features. It could also be used in the era of fully intelligent systems, as it has the ability to process large amounts of data and provide real-time feedback. In addition, it could be used in intelligent scenarios, such as autonomous vehicles, intelligent home systems, and smart city applications.
Overall, the chip model 10AS027E3F27I2LG has the potential to revolutionize the way we use technology in the future. It has the potential to be used in a variety of applications, from consumer electronics to industrial automation. It is also designed to be highly reliable, efficient, and cost-effective, and can be easily upgraded to keep up with the latest technologies and advancements. As the demand for this chip model increases, it is expected to be used in a variety of applications in the future.
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2,131 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $4,298.3715 | $4,298.3715 |
10+ | $4,252.1524 | $42,521.5242 |
100+ | $4,021.0572 | $402,105.7176 |
1000+ | $3,789.9619 | $1,894,980.9680 |
10000+ | $3,466.4286 | $3,466,428.6000 |
The price is for reference only, please refer to the actual quotation! |