Intel Corporation
10AS027E3F27E2LG
10AS027E3F27E2LG ECAD Model
10AS027E3F27E2LG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 240 | |
| Number of Outputs | 240 | |
| Number of Logic Cells | 270000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B672 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 3.25 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | BGA, BGA672,26X26,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AS027E3F27E2LG Overview
The chip model 10AS027E3F27E2LG is a powerful device with many potential applications in the industry. It has been designed to be a highly efficient and cost-effective solution for many different applications. It is a versatile chip model that can be used in a variety of scenarios, such as communication systems, networks, and intelligent systems.
The chip model 10AS027E3F27E2LG is designed to be highly reliable and efficient. It offers a range of features that make it an ideal choice for many applications. It is designed to be low power and energy efficient, making it an ideal choice for applications that require long-term reliability and performance. The chip model is also designed to be compatible with a wide range of technologies, allowing it to be used in a variety of different scenarios.
The chip model 10AS027E3F27E2LG is designed to be highly reliable and efficient. It is designed to be low power and energy efficient, making it an ideal choice for applications that require long-term reliability and performance. It is also designed to be compatible with a wide range of technologies, allowing it to be used in a variety of different scenarios. This allows the chip model to be used in a variety of different communication systems, networks, and intelligent systems.
The chip model 10AS027E3F27E2LG is designed to be highly reliable and efficient. It is designed to be low power and energy efficient, making it an ideal choice for applications that require long-term reliability and performance. It is also designed to be compatible with a wide range of technologies, allowing it to be used in a variety of different scenarios. This allows the chip model to be used in a variety of different communication systems, networks, and intelligent systems. It is also designed to be upgradeable, allowing it to be used in the future as technology advances and new applications are developed.
The chip model 10AS027E3F27E2LG is designed to be highly reliable and efficient. It is designed to be low power and energy efficient, making it an ideal choice for applications that require long-term reliability and performance. It is also designed to be compatible with a wide range of technologies, allowing it to be used in a variety of different scenarios. This allows the chip model to be used in a variety of different communication systems, networks, and intelligent systems. It is also designed to be upgradeable, allowing it to be used in the future as technology advances and new applications are developed. This makes it an ideal choice for applications in the era of fully intelligent systems.
The chip model 10AS027E3F27E2LG is a powerful device with many potential applications in the industry. It has been designed to be a highly efficient and cost-effective solution for many different applications. It is a versatile chip model that can be used in a variety of scenarios, such as communication systems, networks, and intelligent systems. It is designed to be highly reliable and efficient, making it an ideal choice for applications that require long-term reliability and performance. It is also designed to be compatible with a wide range of technologies, allowing it to be used in a variety of different scenarios. This allows the chip model to be used in a variety of different communication systems, networks, and intelligent systems. It is also designed to be upgradeable, allowing it to be used in the future as technology advances and new applications are developed. This makes it an ideal choice for applications in the era of fully intelligent systems.
The chip model 10AS027E3F27E2LG is a powerful device with many potential applications in the industry. As technology advances and new applications are developed, the chip model is designed to be upgradeable, allowing it to be used in the future. This allows the chip model to be used in a variety of different communication systems, networks, and intelligent systems. It is also designed to be compatible with a wide range of technologies, allowing it to be used in a variety of different scenarios. This makes it an ideal choice for applications in the era of fully intelligent systems.
In conclusion, the chip model 10AS027E3F27E2LG is a powerful device with many potential applications in the industry. It is designed to be highly reliable and efficient, making it an ideal choice for applications that require long-term reliability and performance. It is also designed to be compatible with a wide range of technologies, allowing it to be used in a variety of different scenarios. It is also designed to be upgradeable, allowing it to be used in the future as technology advances and new applications are developed. This makes it an ideal choice for applications in the era of fully intelligent systems. The future development of the chip model and related industries will depend on what specific technologies are needed, and what the original design intention of the chip model was. With the right application environment, the chip model 10AS027E3F27E2LG can be used in advanced communication systems and networks,
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Pricing (USD)
| QTY | Unit Price | Ext Price |
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| No reference price found. | ||