Intel Corporation
10AS027E2F27E1SG
10AS027E2F27E1SG ECAD Model
10AS027E2F27E1SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 240 | |
| Number of Outputs | 240 | |
| Number of Logic Cells | 270000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B672 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 3.25 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | BGA, BGA672,26X26,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AS027E2F27E1SG Overview
The chip model 10AS027E2F27E1SG is an advanced semiconductor device designed for embedded processing, digital signal processing, and image processing. It is built with a high-performance architecture and requires the use of HDL language for programming.
The chip model 10AS027E2F27E1SG was originally designed to provide a powerful platform for embedded processing and digital signal processing applications. It can be used for a variety of tasks, including image processing, audio and video processing, and data acquisition. It also has the potential to be upgraded in the future, allowing it to be used for more complex applications.
The chip model 10AS027E2F27E1SG can also be used in the development and popularization of future intelligent robots. The chip model has the capability to process signals in real-time and can be used to control the movement of robots. It can also be used for advanced communication systems, such as the transmission of data between robots and their environment.
In order to use the chip model 10AS027E2F27E1SG effectively, it is necessary to have a good understanding of the HDL language. Programming experience with HDL is essential for programming the chip model, as well as for developing and debugging applications. It is also important to have a good understanding of embedded systems and digital signal processing, as these are the areas in which the chip model is most likely to be deployed. Additionally, knowledge of robotics and mechanical engineering is also necessary for developing and popularizing future intelligent robots.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||