10AS027E1F27I1SG
10AS027E1F27I1SG
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

10AS027E1F27I1SG


10AS027E1F27I1SG
F18-10AS027E1F27I1SG
Active
IC SOC CORTEX-A9 1.5GHZ 672FBGA
672-FBGA, FC (27x27)

10AS027E1F27I1SG ECAD Model


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10AS027E1F27I1SG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Transferred
Supply Voltage-Nom 900 mV
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B672
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Number of Terminals 672
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 3.25 mm
Ihs Manufacturer ALTERA CORP
Package Description 27 X 27 MM, ROHS COMPLIANT, FBGA-672
Reach Compliance Code compliant
HTS Code 8542.39.00.01

10AS027E1F27I1SG Overview



The chip model 10AS027E1F27I1SG is an advanced model designed for high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language for programming, which allows for more efficient and accurate performance. This model is capable of delivering results at a much higher speed than other models, making it an ideal choice for many industries.


The advantages of the chip model 10AS027E1F27I1SG are numerous, but the most noteworthy is its high speed and accuracy. This model is capable of processing data quickly and accurately, allowing for faster and more accurate results. Additionally, this model is also capable of handling large amounts of data, making it suitable for large-scale applications. Furthermore, the model is more energy efficient than other models, which helps to reduce energy costs.


The demand for the chip model 10AS027E1F27I1SG is expected to increase in the future. As more industries require high-performance digital signal processing, embedded processing, and image processing, the demand for this model will likely increase. Furthermore, as technology advances, the need for more efficient and accurate models will likely increase as well. This will likely lead to an increase in demand for the chip model 10AS027E1F27I1SG.


The chip model 10AS027E1F27I1SG can be applied in networks and intelligent scenarios. This model is capable of handling large amounts of data, making it suitable for use in networks, where large amounts of data must be processed quickly and accurately. Additionally, this model is also capable of handling complex tasks, such as image recognition and natural language processing, making it suitable for use in intelligent scenarios.


Finally, the chip model 10AS027E1F27I1SG is capable of being used in the era of fully intelligent systems. This model is capable of handling complex tasks, such as image recognition and natural language processing, making it suitable for use in fully intelligent systems. Furthermore, this model is also capable of handling large amounts of data, making it suitable for use in large-scale applications. As technology advances, the need for more efficient and accurate models will likely increase, making the chip model 10AS027E1F27I1SG an ideal choice for many industries.



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