10AS022E4F27E3SG
10AS022E4F27E3SG
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

10AS022E4F27E3SG


10AS022E4F27E3SG
F18-10AS022E4F27E3SG
Active
IC SOC CORTEX-A9 1.5GHZ 672FBGA
672-FBGA, FC (27x27)

10AS022E4F27E3SG ECAD Model


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10AS022E4F27E3SG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Transferred
Supply Voltage-Nom 900 mV
Number of Inputs 240
Number of Outputs 240
Number of Logic Cells 220000
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Power Supplies 900 mV
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B672
Qualification Status Not Qualified
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 672
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA672,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 3.25 mm
Ihs Manufacturer ALTERA CORP
Package Description BGA, BGA672,26X26,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01

10AS022E4F27E3SG Overview



The chip model 10AS022E4F27E3SG is a highly advanced and innovative product designed to meet the needs of modern networks and intelligent systems. With its advanced features and capabilities, this chip model is expected to be in high demand in various industries in the near future.


The 10AS022E4F27E3SG chip model is designed to provide high performance and reliable operation in a wide range of network and intelligent systems. It is capable of handling complex tasks and can be used for a variety of applications, such as communication networks, industrial automation, and smart home systems. The chip model also supports a range of advanced features, including data encryption, high speed communication, and real-time monitoring.


The 10AS022E4F27E3SG chip model is designed to meet the specific requirements of the industry. It is designed with a low power consumption and high efficiency in order to meet the needs of the industry. The chip model also supports a wide range of operating systems, including Windows, Linux, and Mac OS. Additionally, the chip model is designed to be compatible with a variety of hardware and software platforms, allowing it to be used in a variety of scenarios.


In addition to its advanced features and capabilities, the 10AS022E4F27E3SG chip model has been designed with a number of safety and security features. The chip model is designed to protect against malicious attacks and unauthorized access, as well as to ensure the security of the data it stores. The chip model also includes a number of measures to prevent unauthorized access to the system, such as authentication, encryption, and secure boot.


The 10AS022E4F27E3SG chip model is expected to be in high demand in the near future, as it is capable of meeting the needs of modern networks and intelligent systems. The chip model has already been successfully used in a variety of applications, including industrial automation, communication networks, and smart home systems. In addition, the chip model is expected to be widely used in the era of fully intelligent systems, as it is capable of providing high performance and reliable operation in a wide range of scenarios.


In order to ensure the successful use of the 10AS022E4F27E3SG chip model, it is important to understand the product description and specific design requirements. The product description should include the features and capabilities of the chip model, as well as the safety and security features that are included. Additionally, it is important to understand the actual case studies and precautions that should be taken when using the chip model.


The 10AS022E4F27E3SG chip model is an advanced and innovative product that is expected to be in high demand in various industries in the near future. With its advanced features and capabilities, this chip model is capable of meeting the needs of modern networks and intelligent systems. In addition, the chip model is designed with a number of safety and security features, making it suitable for use in a variety of scenarios. In order to ensure successful use of the 10AS022E4F27E3SG chip model, it is important to understand the product description and specific design requirements, as well as the actual case studies and precautions that should be taken when using the chip model.



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