
Intel Corporation
10AS022E3F27I2LG
10AS022E3F27I2LG ECAD Model
10AS022E3F27I2LG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 240 | |
Number of Outputs | 240 | |
Number of Logic Cells | 220000 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B672 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 672 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA672,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 3.25 mm | |
Ihs Manufacturer | ALTERA CORP | |
Package Description | BGA, BGA672,26X26,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10AS022E3F27I2LG Overview
The chip model 10AS022E3F27I2LG is a high-performance chip that is suitable for digital signal processing, embedded processing, and image processing. It requires the use of HDL language to be used effectively. This chip has the potential to be applied to a variety of networks and intelligent scenarios in the future, making it a powerful tool for the development and popularization of future intelligent robots.
The chip model 10AS022E3F27I2LG is capable of handling complex tasks with ease, making it a great choice for the development of future intelligent robots. It has the ability to process large amounts of data quickly and accurately, allowing it to be used in a variety of applications. From autonomous vehicles to smart home appliances, the chip model 10AS022E3F27I2LG can be used to power the development of these technologies.
The chip model 10AS022E3F27I2LG can also be used in the era of fully intelligent systems. With its powerful processing capabilities and the ability to handle complex tasks, it can be used to develop and implement intelligent systems that are capable of performing a variety of tasks. This chip can be used to create systems that can learn, adapt, and respond to their environment in real-time. This makes it a valuable tool for the development of intelligent systems that can be used in a variety of scenarios.
In order to use the chip model 10AS022E3F27I2LG effectively, certain technical talents are needed. Knowledge of HDL language is essential for programming the chip and making sure that it is used correctly. Additionally, knowledge of artificial intelligence and machine learning is also beneficial for developing intelligent robots and systems that use the chip. With the right combination of technical knowledge and experience, the chip model 10AS022E3F27I2LG can be used to create intelligent robots and systems that are capable of performing a variety of tasks.
The chip model 10AS022E3F27I2LG is a powerful tool for the development and popularization of future intelligent robots and systems. With its powerful processing capabilities and the ability to handle complex tasks, it can be used to create intelligent systems that are capable of learning, adapting, and responding to their environment in real-time. In order to use the chip model 10AS022E3F27I2LG effectively, certain technical talents are needed, such as knowledge of HDL language and artificial intelligence and machine learning. With the right combination of technical knowledge and experience, the chip model 10AS022E3F27I2LG can be used to create intelligent robots and systems that are capable of performing a variety of tasks.
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Pricing (USD)
QTY | Unit Price | Ext Price |
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No reference price found. |