10AS016E4F29I3SG
10AS016E4F29I3SG
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

10AS016E4F29I3SG


10AS016E4F29I3SG
F18-10AS016E4F29I3SG
Active
29 X 29 MM, ROHS COMPLIANT, FBGA-780
29 X 29 MM, ROHS COMPLIANT, FBGA-780

10AS016E4F29I3SG ECAD Model


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10AS016E4F29I3SG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer INTEL CORP
Package Description 29 X 29 MM, ROHS COMPLIANT, FBGA-780
Reach Compliance Code compliant
HTS Code 8542.39.00.01

10AS016E4F29I3SG Datasheet Download


10AS016E4F29I3SG Overview



The chip model 10AS016E4F29I3SG is a product from a leading semiconductor manufacturer that is designed for use in high-performance digital signal processing, embedded processing, and image processing. Its design requirements are designed to meet the needs of these applications, and it is capable of running on the HDL language, which is used to create high-level hardware designs.


The 10AS016E4F29I3SG chip model is designed to be highly efficient, with a low power consumption that makes it suitable for battery-powered devices. It also has a high level of integration, which allows for the integration of multiple components into a single chip. This reduces the cost and size of devices and makes them more suited to smaller form factors.


The 10AS016E4F29I3SG is also designed to be highly reliable, with a high level of fault tolerance and a long life cycle. This makes it ideal for use in applications that require long-term reliability. It is also designed to be highly scalable, so that it can be used in applications of varying complexity.


The 10AS016E4F29I3SG chip model also has a number of advantages over other chip models. It is designed to be highly cost-effective, with a low cost per unit. This makes it ideal for applications that require a large number of chips, such as in embedded systems. It is also designed to be highly flexible, allowing for customization of the design to meet the needs of different applications.


The demand for the 10AS016E4F29I3SG chip model is expected to increase in the future, as more applications require its features. This is due to its efficiency, scalability, and cost-effectiveness. It is also expected to be used in more applications due to its flexibility and reliability.


When designing a product that uses the 10AS016E4F29I3SG chip model, there are a few things to keep in mind. The design should be optimized for the chip model, and it should be designed to take advantage of its features. It is also important to ensure that the design is robust and reliable, as this will ensure that the product performs as expected. Additionally, it is important to ensure that the design is compatible with the HDL language, as this will ensure that the product can be used in high-performance applications.


To ensure the success of a product that uses the 10AS016E4F29I3SG chip model, it is important to understand the product's design requirements and to be aware of any potential risks. Additionally, it is important to consult with experts in the field to ensure that the product meets the necessary requirements and to ensure that it is designed to take advantage of the chip model's features. Finally, it is important to test the product thoroughly before releasing it to the market. By following these steps, a product that uses the 10AS016E4F29I3SG chip model can be designed and implemented successfully.



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Unit Price: $2,113.566
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $1,965.6164 $1,965.6164
10+ $1,944.4807 $19,444.8072
100+ $1,838.8024 $183,880.2420
1000+ $1,733.1241 $866,562.0600
10000+ $1,585.1745 $1,585,174.5000
The price is for reference only, please refer to the actual quotation!

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