10AS016E4F27I3SG
10AS016E4F27I3SG
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

10AS016E4F27I3SG


10AS016E4F27I3SG
F18-10AS016E4F27I3SG
Active
27 X 27 MM, ROHS COMPLIANT, FBGA-672
27 X 27 MM, ROHS COMPLIANT, FBGA-672

10AS016E4F27I3SG ECAD Model


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10AS016E4F27I3SG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer INTEL CORP
Package Description 27 X 27 MM, ROHS COMPLIANT, FBGA-672
Reach Compliance Code compliant
HTS Code 8542.39.00.01

10AS016E4F27I3SG Datasheet Download


10AS016E4F27I3SG Overview



The chip model 10AS016E4F27I3SG is a high-performance chip that has been developed to meet the needs of the modern communication industry. This chip is designed to provide a robust solution for the ever-growing demand for data and communication services. It is capable of operating at high speeds, while also providing a low power consumption and a high level of reliability.


The chip model 10AS016E4F27I3SG is designed to be used in a wide variety of applications, ranging from wireless communication networks to satellite communication systems. It can be used in both wired and wireless networks, and is capable of supporting a wide range of communication protocols. In addition, the chip model is designed to be compatible with a variety of operating systems, such as Linux, Windows, and Mac OS X.


The chip model 10AS016E4F27I3SG is designed to be able to adapt to the changing needs of the communication industry. It is designed to be able to process data quickly and efficiently, while also providing a low power consumption. This allows it to be used in a variety of applications, including those that require high-speed data processing.


In terms of industry trends, the chip model 10AS016E4F27I3SG is designed to be able to support the latest technologies. This includes support for 5G networks, as well as the emergence of the Internet of Things (IoT). The chip model is also capable of supporting the development of new technologies, such as artificial intelligence (AI) and machine learning (ML). This allows it to be used in a variety of advanced communication systems, such as those that require the use of AI and ML.


The chip model 10AS016E4F27I3SG is also designed to be able to be used in the future. This includes the possibility of future upgrades, as well as the use of the chip model in the era of fully intelligent systems. This means that the chip model can be used in a variety of networks, from wireless networks to satellite communication systems. It can also be used in intelligent scenarios, such as those that require the use of AI and ML.


Overall, the chip model 10AS016E4F27I3SG is a high-performance chip that is designed to meet the needs of the modern communication industry. It is designed to be able to support the latest technologies, while also being able to adapt to the changing needs of the communication industry. It is also designed to be able to be used in a variety of networks, as well as in intelligent scenarios. This makes it an ideal solution for the ever-growing demand for data and communication services.



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Unit Price: $450.4027
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $418.8745 $418.8745
10+ $414.3705 $4,143.7048
100+ $391.8503 $39,185.0349
1000+ $369.3302 $184,665.1070
10000+ $337.8020 $337,802.0250
The price is for reference only, please refer to the actual quotation!

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