Intel Corporation
10AS016E3F27E2LG
10AS016E3F27E2LG ECAD Model
10AS016E3F27E2LG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 240 | |
| Number of Outputs | 240 | |
| Number of Logic Cells | 160000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B672 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 3.25 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | BGA, BGA672,26X26,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AS016E3F27E2LG Overview
The chip model 10AS016E3F27E2LG is a high-performance chip designed for digital signal processing, embedded processing, and image processing. It requires the use of HDL language, making it an ideal choice for a wide range of applications. This chip model is suitable for many applications in networks and intelligent scenarios, such as autonomous vehicles, robotics, and machine learning.
The 10AS016E3F27E2LG chip model can be used in the development and popularization of future intelligent robots. This chip model provides the necessary high-performance processing capabilities for robots to be able to move, sense, and plan. It can be used to power robots with advanced artificial intelligence capabilities, such as facial recognition, natural language processing, and object recognition.
Using the chip model 10AS016E3F27E2LG effectively requires technical talents with knowledge of HDL language and digital signal processing. A strong understanding of the chip model’s capabilities and limitations is also necessary. With the right combination of skills and knowledge, this chip model can be used to create powerful and intelligent robots that can be used in a variety of scenarios.
In the era of fully intelligent systems, the chip model 10AS016E3F27E2LG can be used to power a variety of applications. It can be used to develop systems that can process large amounts of data quickly and accurately, such as autonomous vehicles and smart home systems. It can also be used to create intelligent robots that can interact with their environment and learn from it.
The chip model 10AS016E3F27E2LG is a powerful and versatile chip that can be used in a variety of applications. It is suitable for high-performance digital signal processing, embedded processing, and image processing, and can be used to develop and popularize future intelligent robots. Technical talents with knowledge of HDL language and digital signal processing are needed to use the model effectively, and it can be used in the era of fully intelligent systems to power a variety of applications.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||