
Intel Corporation
10AS016E3F27E1SG
10AS016E3F27E1SG ECAD Model
10AS016E3F27E1SG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 240 | |
Number of Outputs | 240 | |
Number of Logic Cells | 160000 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B672 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 672 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA672,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 3.25 mm | |
Ihs Manufacturer | ALTERA CORP | |
Package Description | BGA, BGA672,26X26,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10AS016E3F27E1SG Overview
The chip model 10AS016E3F27E1SG is a high-performance chip developed by a leading semiconductor company, designed for digital signal processing, embedded processing, image processing, and other related applications. The chip model is suitable for use with HDL (Hardware Description Language) and can be used to create complex systems for various purposes.
The 10AS016E3F27E1SG chip has several advantages over other models in the same range. It has a high-performance processor with a large cache and an advanced memory controller, which makes it suitable for high-speed data processing. It also has a wide range of interfaces, including Ethernet, USB, and HDMI, which makes it suitable for applications that require a lot of data transfer. Moreover, the chip model also has a low power consumption and is highly reliable, which makes it suitable for applications where power conservation is important.
The demand for the 10AS016E3F27E1SG chip model is expected to increase in the future, as more applications require its high-performance features. The chip model is increasingly being used in the development of intelligent robots, as it is capable of providing the necessary processing power and data transfer speed. Furthermore, the chip model is also being used in the development of autonomous vehicles, as its advanced memory controller and low power consumption make it suitable for such applications.
In order to use the 10AS016E3F27E1SG chip model effectively, technical talents such as engineers and programmers are needed. These professionals must be knowledgeable in HDL programming, as well as in the use of the chip model’s various interfaces and power consumption requirements. Furthermore, they must also be familiar with the various applications of the chip model and be able to optimize the chip model for different applications.
Overall, the 10AS016E3F27E1SG chip model is a reliable and versatile chip model, suitable for a wide range of applications. Its high-performance processor and advanced memory controller make it suitable for use in the development of intelligent robots and autonomous vehicles. In order to use the chip model effectively, technical talents such as engineers and programmers are needed, and the demand for the chip model is expected to increase in the future.
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QTY | Unit Price | Ext Price |
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