Intel Corporation
10AS016C4U19I3LG
10AS016C4U19I3LG ECAD Model
10AS016C4U19I3LG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 192 | |
| Number of Outputs | 192 | |
| Number of Logic Cells | 160000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA484,22X22,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 19 mm | |
| Length | 19 mm | |
| Seated Height-Max | 3.25 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | FBGA, BGA484,22X22,32 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel |
10AS016C4U19I3LG Overview
The chip model 10AS016C4U19I3LG is a cutting-edge semiconductor device that has revolutionized the industry. It is designed to be used in a wide range of applications, including networking, intelligent scenarios, and fully intelligent systems. This chip model is designed to offer high performance, reliability, and low power consumption.
In terms of industry trends, the chip model 10AS016C4U19I3LG has been designed to meet the needs of the ever-evolving technology landscape. It is designed to be compatible with a wide range of technologies, such as 5G, Wi-Fi, Bluetooth, and more. This chip model is also designed to be compatible with the latest development trends in the industry, such as artificial intelligence, machine learning, and the Internet of Things.
The product description of the chip model 10AS016C4U19I3LG includes its features, specifications, and design requirements. It is designed to be highly reliable, with a low power consumption rate. This chip model is also designed to be highly efficient, with a high speed data transfer rate. Additionally, it is designed to be compatible with a wide range of technologies, including 5G, Wi-Fi, Bluetooth, and more.
In terms of actual case studies, the chip model 10AS016C4U19I3LG has been tested in a variety of scenarios. It has been tested in both indoor and outdoor environments, in both urban and rural settings. It has been tested in a variety of networks, including 5G, Wi-Fi, and Bluetooth. Additionally, it has been tested in a variety of intelligent scenarios, including machine learning and artificial intelligence.
In terms of precautions, it is important to note that the chip model 10AS016C4U19I3LG is designed to be highly reliable. However, it is important to ensure that the chip model is used in the correct environment and with the correct technologies. Additionally, it is important to ensure that the chip model is used with the latest development trends in the industry, such as artificial intelligence, machine learning, and the Internet of Things.
In conclusion, the chip model 10AS016C4U19I3LG is a cutting-edge semiconductor device that has revolutionized the industry. It is designed to be compatible with a wide range of technologies, including 5G, Wi-Fi, Bluetooth, and more. Additionally, it is designed to be highly reliable, with a low power consumption rate. It has been tested in a variety of scenarios, including indoor and outdoor environments, in both urban and rural settings. It is important to ensure that the chip model is used in the correct environment and with the correct technologies.
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2,427 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,261.4364 | $2,261.4364 |
| 10+ | $2,237.1198 | $22,371.1984 |
| 100+ | $2,115.5372 | $211,553.7240 |
| 1000+ | $1,993.9546 | $996,977.3200 |
| 10000+ | $1,823.7390 | $1,823,739.0000 |
| The price is for reference only, please refer to the actual quotation! | ||