Altera Corporation
EPM9560RI208-15
EPM9560RI208-15 ECAD Model
EPM9560RI208-15 Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 5 V | |
| Propagation Delay | 16.6 ns | |
| Number of Macro Cells | 560 | |
| Number of I/O Lines | 153 | |
| Programmable Logic Type | EE PLD | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 153 I/O | |
| Additional Feature | 560 MACROCELLS; 772 FLIP FLOPS; CONFIGURABLE I/O OPERATION - 3.3V OR 5V | |
| Clock Frequency-Max | 117.6 MHz | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 3.3/5,5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-PQFP-G208 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Number of Terminals | 208 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HFQFP | |
| Package Equivalence Code | HQFP208,1.2SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, HEAT SINK/SLUG, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | QFP | |
| Package Description | HFQFP, HQFP208,1.2SQ,20 | |
| Pin Count | 208 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EPM9560RI208-15 Datasheet Download
EPM9560RI208-15 Overview
The chip model EPM9560RI208-15 is a high-performance, low-power embedded microcontroller developed by Altera Corporation. It is based on the ARM Cortex-M3 architecture and has a wide range of features, such as a rich set of peripherals, a high-speed 10/100 Ethernet MAC, and a high-speed USB 2.0 device controller. It is designed to provide a low-cost solution for embedded system designers and can be used in a wide range of applications, such as automotive, industrial, consumer, and medical.
The chip model EPM9560RI208-15 has several advantages that make it an attractive choice for embedded system designers. It has a low power consumption, allowing it to be used in battery-powered applications. It also has a high speed 10/100 Ethernet MAC, which enables it to support high-speed data transfer. Additionally, it has a high-speed USB 2.0 device controller, which allows it to be used in applications that require fast data transfer. Moreover, it has a rich set of peripherals, which allows it to be used in a wide range of applications.
The chip model EPM9560RI208-15 is expected to have a strong demand in the future, especially in the automotive and industrial sectors. It is expected to be used in a variety of applications, such as vehicle control systems, industrial automation, and medical devices. Additionally, it is also expected to be used in consumer electronics, such as home automation and entertainment systems.
The original design intention of the chip model EPM9560RI208-15 was to provide a low-cost solution for embedded system designers. However, it is possible that the chip model could be upgraded in the future to support the latest technologies. For instance, the chip model could be upgraded to support advanced communication systems, such as 5G or Wi-Fi 6. Additionally, the chip model could be upgraded to support the latest security protocols, such as TLS and IPSec.
In conclusion, the chip model EPM9560RI208-15 is a high-performance, low-power embedded microcontroller that is designed to provide a low-cost solution for embedded system designers. It has several advantages, such as low power consumption, high-speed 10/100 Ethernet MAC, and a high-speed USB 2.0 device controller, which make it an attractive choice for embedded system designers. It is expected to have a strong demand in the future, especially in the automotive and industrial sectors. Additionally, it is possible that the chip model could be upgraded in the future to support the latest technologies, such as advanced communication systems and the latest security protocols.
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|---|---|---|
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