Altera Corporation
EPM7512BUC169-10N
EPM7512BUC169-10N ECAD Model
EPM7512BUC169-10N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 5.5 ns | |
| Number of Macro Cells | 512 | |
| Number of I/O Lines | 141 | |
| Programmable Logic Type | EE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 141 I/O | |
| Additional Feature | YES | |
| Clock Frequency-Max | 163.9 MHz | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 1.8/3.3,2.5 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B169 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 169 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA169,13X13,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 11 mm | |
| Length | 11 mm | |
| Seated Height-Max | 1.55 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LFBGA, BGA169,13X13,32 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EPM7512BUC169-10N Overview
The chip model EPM7512BUC169-10N is a powerful, versatile, and cost-effective device for high-performance digital signal processing, embedded processing, and image processing. It is designed for applications that require the use of HDL language, and is ideal for applications that require high-speed performance and low power consumption.
The EPM7512BUC169-10N is a high-performance device that is capable of operating at speeds up to 100MHz. It is also equipped with a wide range of peripherals, including Ethernet, USB, UART, I2C, and SPI. This makes it ideal for applications that require a variety of different interfaces, such as embedded systems and image processing.
The chip model EPM7512BUC169-10N is also designed to be highly efficient, consuming only a fraction of the power of traditional devices. This makes it an ideal choice for applications that require low power consumption, such as battery-powered devices. The device is also designed to be highly reliable, with a high-reliability rating and a long lifetime.
The EPM7512BUC169-10N is expected to be in high demand in the future, as more applications require the use of HDL language and high-performance digital signal processing. This is due to the increasing demand for embedded systems and image processing applications, as well as the need for more efficient and reliable devices. As such, the EPM7512BUC169-10N is expected to be in high demand in the future.
In terms of the application environment, the EPM7512BUC169-10N may require the support of new technologies in order to meet the demands of the applications. This could include support for new protocols, as well as the adoption of new technologies such as artificial intelligence and machine learning. The EPM7512BUC169-10N is also expected to be compatible with existing technologies, such as Bluetooth, Wi-Fi, and Zigbee.
In conclusion, the EPM7512BUC169-10N is a powerful and cost-effective device for high-performance digital signal processing, embedded processing, and image processing. It is designed for applications that require the use of HDL language, and is expected to be in high demand in the future. The device is also highly efficient and reliable, and may require the support of new technologies in order to meet the demands of the applications.
3,189 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||