EPM7512BQC208-10N
EPM7512BQC208-10N
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Altera Corporation

EPM7512BQC208-10N


EPM7512BQC208-10N
F53-EPM7512BQC208-10N
Active
EE PLD, 5.5 ns, 512-Cell, CMOS, FQFP, QFP208,1.2SQ,20
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EPM7512BQC208-10N ECAD Model


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EPM7512BQC208-10N Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Propagation Delay 5.5 ns
Number of Macro Cells 512
Number of I/O Lines 176
Programmable Logic Type EE PLD
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 0 DEDICATED INPUTS, 176 I/O
Additional Feature YES
Clock Frequency-Max 163.9 MHz
In-System Programmable YES
JTAG BST YES
Output Function MACROCELL
Power Supplies 1.8/3.3,2.5 V
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PQFP-G208
Qualification Status Not Qualified
JESD-609 Code e3
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Number of Terminals 208
Package Body Material PLASTIC/EPOXY
Package Code FQFP
Package Equivalence Code QFP208,1.2SQ,20
Package Shape SQUARE
Package Style FLATPACK, FINE PITCH
Surface Mount YES
Terminal Finish MATTE TIN
Terminal Form GULL WING
Terminal Pitch 500 µm
Terminal Position QUAD
Width 28 mm
Length 28 mm
Seated Height-Max 4.1 mm
Ihs Manufacturer INTEL CORP
Package Description FQFP, QFP208,1.2SQ,20
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EPM7512BQC208-10N Overview



The chip model EPM7512BQC208-10N is a cutting-edge semiconductor device manufactured by Altera Corporation. It is a member of the EPM family of FPGA devices and is designed for high-speed, high-density applications. This chip model has a low power consumption and is designed to operate in a wide temperature range. It is also highly reliable and provides superior performance.


The EPM7512BQC208-10N chip model is used in a variety of applications, including digital signal processing, communications, image processing, and other embedded system applications. It is also used in high-end networking applications such as routers, switches, and wireless base stations. This chip model is also used in automotive applications, including automotive body control, engine control, and safety systems.


The industry trends of the EPM7512BQC208-10N chip model are constantly changing. With the advent of new technologies, the chip model is being used in more applications than ever before. For example, it can be used in the era of fully intelligent systems, such as artificial intelligence, machine learning, and natural language processing. It can also be used in networks to enable intelligent scenarios, such as autonomous vehicles, intelligent buildings, and smart cities.


The product description of the EPM7512BQC208-10N chip model includes features such as a high-speed transceiver, embedded memory blocks, and configurable logic blocks. It also includes an on-chip JTAG interface, which allows for easy programming and debugging. The chip model also has a wide operating temperature range and is designed to be highly reliable.


When designing with the EPM7512BQC208-10N chip model, there are some important considerations to keep in mind. For example, the chip model requires a specific design flow, which should be followed to ensure that the design meets the desired specifications. Additionally, the chip model requires specific power supply requirements in order to function correctly. It is also important to consider the environmental conditions that the chip model will be exposed to in order to ensure that it will work properly.


Case studies can be helpful when designing with the EPM7512BQC208-10N chip model. These case studies can provide valuable insight into the design process and help to ensure that the chip model is used correctly. Additionally, case studies can provide information on how the chip model has been used in similar applications and what design considerations should be taken into account.


In conclusion, the EPM7512BQC208-10N chip model is a cutting-edge semiconductor device that can be used in a variety of applications. It is being used in more applications than ever before, and its use in the era of fully intelligent systems is becoming increasingly popular. It is important to consider the product description and design requirements when designing with the chip model, as well as environmental conditions and power supply requirements. Case studies can provide valuable insight into the design process and help to ensure that the chip model is used correctly.



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