
Altera Corporation
EPM7512BQC208-10N
EPM7512BQC208-10N ECAD Model
EPM7512BQC208-10N Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Propagation Delay | 5.5 ns | |
Number of Macro Cells | 512 | |
Number of I/O Lines | 176 | |
Programmable Logic Type | EE PLD | |
Temperature Grade | COMMERCIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 0 DEDICATED INPUTS, 176 I/O | |
Additional Feature | YES | |
Clock Frequency-Max | 163.9 MHz | |
In-System Programmable | YES | |
JTAG BST | YES | |
Output Function | MACROCELL | |
Power Supplies | 1.8/3.3,2.5 V | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PQFP-G208 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 70 °C | |
Number of Terminals | 208 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FQFP | |
Package Equivalence Code | QFP208,1.2SQ,20 | |
Package Shape | SQUARE | |
Package Style | FLATPACK, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | MATTE TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Width | 28 mm | |
Length | 28 mm | |
Seated Height-Max | 4.1 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | FQFP, QFP208,1.2SQ,20 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
EPM7512BQC208-10N Overview
The chip model EPM7512BQC208-10N is a cutting-edge semiconductor device manufactured by Altera Corporation. It is a member of the EPM family of FPGA devices and is designed for high-speed, high-density applications. This chip model has a low power consumption and is designed to operate in a wide temperature range. It is also highly reliable and provides superior performance.
The EPM7512BQC208-10N chip model is used in a variety of applications, including digital signal processing, communications, image processing, and other embedded system applications. It is also used in high-end networking applications such as routers, switches, and wireless base stations. This chip model is also used in automotive applications, including automotive body control, engine control, and safety systems.
The industry trends of the EPM7512BQC208-10N chip model are constantly changing. With the advent of new technologies, the chip model is being used in more applications than ever before. For example, it can be used in the era of fully intelligent systems, such as artificial intelligence, machine learning, and natural language processing. It can also be used in networks to enable intelligent scenarios, such as autonomous vehicles, intelligent buildings, and smart cities.
The product description of the EPM7512BQC208-10N chip model includes features such as a high-speed transceiver, embedded memory blocks, and configurable logic blocks. It also includes an on-chip JTAG interface, which allows for easy programming and debugging. The chip model also has a wide operating temperature range and is designed to be highly reliable.
When designing with the EPM7512BQC208-10N chip model, there are some important considerations to keep in mind. For example, the chip model requires a specific design flow, which should be followed to ensure that the design meets the desired specifications. Additionally, the chip model requires specific power supply requirements in order to function correctly. It is also important to consider the environmental conditions that the chip model will be exposed to in order to ensure that it will work properly.
Case studies can be helpful when designing with the EPM7512BQC208-10N chip model. These case studies can provide valuable insight into the design process and help to ensure that the chip model is used correctly. Additionally, case studies can provide information on how the chip model has been used in similar applications and what design considerations should be taken into account.
In conclusion, the EPM7512BQC208-10N chip model is a cutting-edge semiconductor device that can be used in a variety of applications. It is being used in more applications than ever before, and its use in the era of fully intelligent systems is becoming increasingly popular. It is important to consider the product description and design requirements when designing with the chip model, as well as environmental conditions and power supply requirements. Case studies can provide valuable insight into the design process and help to ensure that the chip model is used correctly.
5,686 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
No reference price found. |