Altera Corporation
EPM7512BFI256-7N
EPM7512BFI256-7N ECAD Model
EPM7512BFI256-7N Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 5.5 ns | |
| Number of Macro Cells | 512 | |
| Number of I/O Lines | 212 | |
| Programmable Logic Type | EE PLD | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 212 I/O | |
| Additional Feature | YES | |
| Clock Frequency-Max | 163.9 MHz | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 1.8/3.3,2.5 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,20X20,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA256,20X20,50 | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
EPM7512BFI256-7N Datasheet Download
EPM7512BFI256-7N Overview
The chip model EPM7512BFI256-7N is a high-performance digital signal processor (DSP) designed for embedded processing, image processing, and other applications. It is based on the Altera MAX II architecture and can be programmed using the HDL language. The original design intention of the chip was to provide a reliable, high-performance processor for embedded applications. It is also designed to be upgradable, allowing for future upgrades and improvements.
The chip model EPM7512BFI256-7N can be applied to advanced communication systems such as 4G/5G networks. It is suitable for a variety of intelligent scenarios, including autonomous driving, smart home, and smart city. It can also be used in the era of fully intelligent systems, such as artificial intelligence (AI) and machine learning (ML). With its high-performance capabilities and upgradability, the chip model EPM7512BFI256-7N is an ideal choice for a wide range of applications.
In conclusion, the chip model EPM7512BFI256-7N is a powerful digital signal processor that is suitable for a variety of applications. Its original design intention was to provide a reliable and upgradable processor for embedded applications. It can also be applied to advanced communication systems and intelligent scenarios, and is suitable for use in the era of fully intelligent systems.
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1,216 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,663.5200 | $2,663.5200 |
| 10+ | $2,634.8800 | $26,348.8000 |
| 100+ | $2,491.6800 | $249,168.0000 |
| 1000+ | $2,348.4800 | $1,174,240.0000 |
| 10000+ | $2,148.0000 | $2,148,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||