
Altera Corporation
EPM7512BFI256-5
EPM7512BFI256-5 ECAD Model
EPM7512BFI256-5 Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Propagation Delay | 5.5 ns | |
Number of Macro Cells | 512 | |
Number of I/O Lines | 212 | |
Programmable Logic Type | EE PLD | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 0 DEDICATED INPUTS, 212 I/O | |
Additional Feature | YES | |
Clock Frequency-Max | 163.9 MHz | |
In-System Programmable | YES | |
JTAG BST | YES | |
Output Function | MACROCELL | |
Power Supplies | 1.8/3.3,2.5 V | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 220 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA256,20X20,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 17 mm | |
Length | 17 mm | |
Seated Height-Max | 2.1 mm | |
Ihs Manufacturer | ALTERA CORP | |
Package Description | BGA, BGA256,20X20,50 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Part Package Code | BGA | |
Pin Count | 256 | |
ECCN Code | 3A991.D |
EPM7512BFI256-5 Datasheet Download
EPM7512BFI256-5 Overview
The chip model EPM7512BFI256-5 is a high-performance device designed for digital signal processing, embedded processing, and image processing. It is manufactured by Altera Corporation and features an array of 256 macrocells, an 8K-bit RAM block, and a wide range of logic functions. It is designed to be used with the HDL language, which is a powerful language for designing digital logic circuits.
The chip model EPM7512BFI256-5 offers several advantages. It has a high operating frequency and a low power consumption, making it suitable for high-performance applications. It also has an array of configurable logic blocks, allowing for greater flexibility in design. Furthermore, it is compatible with a variety of external memory types, making it suitable for a wide range of applications.
The demand for the chip model EPM7512BFI256-5 is expected to increase in the future. As digital signal processing and embedded processing become more important in industry, the need for high-performance devices will increase. Furthermore, the chip model is suitable for a wide range of applications, from consumer electronics to automotive and aerospace systems, making it an attractive option for many industries.
When designing with the chip model EPM7512BFI256-5, it is important to consider the specific design requirements. The device has a wide range of logic functions, so it is important to ensure that the design meets the desired specifications. Furthermore, it is important to consider the type of external memory that is compatible with the device, as this will affect the overall performance. Finally, it is important to pay attention to the power consumption of the device, as this will affect the overall efficiency of the design.
To demonstrate how to use the chip model EPM7512BFI256-5, several case studies have been conducted. For example, one case study demonstrated how the device can be used to design an image processing system. The study showed that the device was capable of performing the necessary operations with a high degree of accuracy and efficiency. Furthermore, the study also provided recommendations for power optimization and design considerations.
In conclusion, the chip model EPM7512BFI256-5 is an attractive option for digital signal processing, embedded processing, and image processing applications. It offers several advantages, including a high operating frequency and low power consumption, as well as a wide range of logic functions. Furthermore, the expected demand for the device is expected to increase in the future, making it an attractive option for many industries. When designing with the chip model, it is important to consider the specific design requirements and to pay attention to the power consumption of the device. Finally, several case studies have demonstrated how the device can be used to design image processing systems with a high degree of accuracy and efficiency.
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3,274 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $31.9770 | $31.9770 |
10+ | $31.6332 | $316.3319 |
100+ | $29.9140 | $2,991.3993 |
1000+ | $28.1948 | $14,097.3990 |
10000+ | $25.7879 | $25,787.9250 |
The price is for reference only, please refer to the actual quotation! |