EPM7512BFI256-10
EPM7512BFI256-10
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rohs

Altera Corporation

EPM7512BFI256-10


EPM7512BFI256-10
F53-EPM7512BFI256-10
Active
EE PLD, 5.5 ns, 512-Cell, CMOS, BGA, BGA256,16X16,40
BGA, BGA256,16X16,40

EPM7512BFI256-10 ECAD Model


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EPM7512BFI256-10 Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Propagation Delay 5.5 ns
Number of Macro Cells 512
Number of I/O Lines 212
Programmable Logic Type EE PLD
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology CMOS
Organization 0 DEDICATED INPUTS, 212 I/O
Additional Feature YES
Clock Frequency-Max 163.9 MHz
In-System Programmable YES
JTAG BST YES
Output Function MACROCELL
Power Supplies 1.8/3.3,2.5 V
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 220
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer ALTERA CORP
Part Package Code BGA
Package Description BGA, BGA256,16X16,40
Pin Count 256
Reach Compliance Code compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

EPM7512BFI256-10 Datasheet Download


EPM7512BFI256-10 Overview



The chip model EPM7512BFI256-10 is a programmable logic device that is widely used in various industries. It is a low-cost, high-performance chip that is suitable for a variety of applications. This chip is designed to provide a wide range of features, including a wide range of memory, a large number of I/O pins, and a variety of different logic functions.


In terms of industry trends, the chip model EPM7512BFI256-10 is increasingly being used in a variety of applications. This chip is being used in a variety of industries, such as automotive, industrial, and consumer electronics. It is also being used in the development of new technologies, such as artificial intelligence (AI) and machine learning (ML).


In terms of future development, the chip model EPM7512BFI256-10 is expected to become increasingly popular in the world of networks and intelligent systems. It is believed that this chip will be used in the development and popularization of future intelligent robots. It is also expected to be used in the development of new technologies, such as AI and ML, that will be used in the era of fully intelligent systems.


In terms of the application environment, the chip model EPM7512BFI256-10 requires the support of new technologies for its effective use. This includes the use of AI and ML technologies to help develop and optimize the chip’s performance. It also requires the use of specialized technical talents, such as software engineers, to use the chip effectively.


In conclusion, the chip model EPM7512BFI256-10 is a versatile and powerful chip that is increasingly being used in a variety of applications. It is expected to become increasingly popular in the world of networks and intelligent systems. It requires the support of new technologies, such as AI and ML, as well as specialized technical talents, such as software engineers, to use the chip effectively. Therefore, it is important to understand the industry trends of the chip model EPM7512BFI256-10, as well as the future development of related industries, in order to use the chip effectively.



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QTY Unit Price Ext Price
1+ $55.8563 $55.8563
10+ $55.2557 $552.5566
100+ $52.2526 $5,225.2635
1000+ $49.2496 $24,624.8050
10000+ $45.0454 $45,045.3750
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