
Altera Corporation
EPM7512BFI256-10
EPM7512BFI256-10 ECAD Model
EPM7512BFI256-10 Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Propagation Delay | 5.5 ns | |
Number of Macro Cells | 512 | |
Number of I/O Lines | 212 | |
Programmable Logic Type | EE PLD | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 0 DEDICATED INPUTS, 212 I/O | |
Additional Feature | YES | |
Clock Frequency-Max | 163.9 MHz | |
In-System Programmable | YES | |
JTAG BST | YES | |
Output Function | MACROCELL | |
Power Supplies | 1.8/3.3,2.5 V | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 220 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 17 mm | |
Length | 17 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | ALTERA CORP | |
Part Package Code | BGA | |
Package Description | BGA, BGA256,16X16,40 | |
Pin Count | 256 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
EPM7512BFI256-10 Datasheet Download
EPM7512BFI256-10 Overview
The chip model EPM7512BFI256-10 is a programmable logic device that is widely used in various industries. It is a low-cost, high-performance chip that is suitable for a variety of applications. This chip is designed to provide a wide range of features, including a wide range of memory, a large number of I/O pins, and a variety of different logic functions.
In terms of industry trends, the chip model EPM7512BFI256-10 is increasingly being used in a variety of applications. This chip is being used in a variety of industries, such as automotive, industrial, and consumer electronics. It is also being used in the development of new technologies, such as artificial intelligence (AI) and machine learning (ML).
In terms of future development, the chip model EPM7512BFI256-10 is expected to become increasingly popular in the world of networks and intelligent systems. It is believed that this chip will be used in the development and popularization of future intelligent robots. It is also expected to be used in the development of new technologies, such as AI and ML, that will be used in the era of fully intelligent systems.
In terms of the application environment, the chip model EPM7512BFI256-10 requires the support of new technologies for its effective use. This includes the use of AI and ML technologies to help develop and optimize the chip’s performance. It also requires the use of specialized technical talents, such as software engineers, to use the chip effectively.
In conclusion, the chip model EPM7512BFI256-10 is a versatile and powerful chip that is increasingly being used in a variety of applications. It is expected to become increasingly popular in the world of networks and intelligent systems. It requires the support of new technologies, such as AI and ML, as well as specialized technical talents, such as software engineers, to use the chip effectively. Therefore, it is important to understand the industry trends of the chip model EPM7512BFI256-10, as well as the future development of related industries, in order to use the chip effectively.
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5,851 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $55.8563 | $55.8563 |
10+ | $55.2557 | $552.5566 |
100+ | $52.2526 | $5,225.2635 |
1000+ | $49.2496 | $24,624.8050 |
10000+ | $45.0454 | $45,045.3750 |
The price is for reference only, please refer to the actual quotation! |