Altera Corporation
EPM7256AFI256-7
EPM7256AFI256-7 ECAD Model
EPM7256AFI256-7 Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Propagation Delay | 7.5 ns | |
| Number of Macro Cells | 256 | |
| Number of I/O Lines | 164 | |
| Programmable Logic Type | EE PLD | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 164 I/O | |
| Additional Feature | YES | |
| Clock Frequency-Max | 125 MHz | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 2.5/3.3,3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2.1 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA256,16X16,40 | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EPM7256AFI256-7 Datasheet Download
EPM7256AFI256-7 Overview
The chip model EPM7256AFI256-7 is a high-performance, low-power device designed for a variety of applications. It is a field programmable gate array (FPGA) with a capacity of 256K logic elements. It is designed to meet the needs of a variety of applications, including but not limited to digital signal processing, telecommunications, and embedded systems.
The chip model EPM7256AFI256-7 features a wide range of features, including on-chip memory, high-speed transceivers, and a variety of embedded processors. It also includes a variety of I/O interfaces, including Ethernet, USB, and PCIe. This makes it suitable for a variety of applications, including industrial automation, medical imaging, automotive, and consumer electronics.
The chip model EPM7256AFI256-7 is designed to provide a high level of flexibility and scalability. This makes it an ideal choice for future upgrades and applications in advanced communication systems. It is capable of supporting the latest technologies, such as 5G, Wi-Fi 6, and Bluetooth 5.0, as well as emerging technologies like artificial intelligence and machine learning.
The chip model EPM7256AFI256-7 can be used to create intelligent networks and scenarios. It is capable of powering a variety of applications, including autonomous vehicles, smart home systems, and industrial automation. It is also capable of supporting the latest communication protocols, such as 5G and Wi-Fi 6, making it suitable for the era of fully intelligent systems.
In conclusion, the chip model EPM7256AFI256-7 is a high-performance, low-power device designed for a variety of applications. It is designed to provide a high level of flexibility and scalability, making it an ideal choice for future upgrades and applications in advanced communication systems. It is capable of supporting the latest technologies and communication protocols, making it suitable for the era of fully intelligent systems.
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1,897 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $129.3642 | $129.3642 |
| 10+ | $127.9732 | $1,279.7320 |
| 100+ | $121.0181 | $12,101.8131 |
| 1000+ | $114.0631 | $57,031.5330 |
| 10000+ | $104.3260 | $104,325.9750 |
| The price is for reference only, please refer to the actual quotation! | ||