Altera Corporation
EPM7064SLC84-6N
EPM7064SLC84-6N ECAD Model
EPM7064SLC84-6N Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 5 V | |
| Propagation Delay | 6 ns | |
| Number of Macro Cells | 64 | |
| Number of I/O Lines | 68 | |
| Programmable Logic Type | EE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 68 I/O | |
| Additional Feature | CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | |
| Clock Frequency-Max | 200 MHz | |
| In-System Programmable | YES | |
| JTAG BST | NO | |
| Output Function | MACROCELL | |
| Power Supplies | 3.3/5,5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQCC-J84 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 84 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCJ | |
| Package Equivalence Code | LDCC84,1.2SQ | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Width | 29.3116 mm | |
| Length | 29.3116 mm | |
| Seated Height-Max | 5.08 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | LCC | |
| Package Description | QCCJ, LDCC84,1.2SQ | |
| Pin Count | 84 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EPM7064SLC84-6N Datasheet Download
EPM7064SLC84-6N Overview
The chip model EPM7064SLC84-6N is a device created by Altera Corporation, a leading provider of FPGA, CPLD, and power management solutions. It is a high-performance, low-power, programmable logic device that is widely used in many different applications. This chip model has been designed to meet the requirements of modern digital systems, providing high-speed logic, memory, and high-performance digital-to-analog conversion capabilities.
The industry trends of the chip model EPM7064SLC84-6N are constantly evolving, with new technologies and advancements being developed to improve the performance and power efficiency of the device. In order to keep up with the latest trends in the industry, the chip model needs to be upgraded and updated with new features and technologies. This could include adding support for new communication protocols, increasing the speed of the device, or adding new features to improve its performance.
The original design intention of the chip model EPM7064SLC84-6N was to provide a high-performance and low-power solution for digital systems. This chip model has the potential to be upgraded and applied to advanced communication systems, such as 5G networks and the Internet of Things (IoT). It could also be used in smart home and industrial automation applications, as well as in autonomous driving systems.
The possible future applications of the chip model EPM7064SLC84-6N are vast and could be used in a variety of networks and intelligent scenarios. It could be used in networks for data communication, video streaming, and wireless communication. It could also be used in intelligent scenarios such as facial recognition, machine learning, and natural language processing. In the era of fully intelligent systems, the chip model could be used to power autonomous robots, drones, and other intelligent machines.
Overall, the chip model EPM7064SLC84-6N is a highly versatile and powerful device that can be used in a variety of applications. Its potential for future upgrades and applications makes it a great choice for digital systems and intelligent scenarios. With the right technologies and advancements, this chip model could be used to power the future of communication systems and intelligent machines.
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