Altera Corporation
EPM570T100I3N
EPM570T100I3N ECAD Model
EPM570T100I3N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 5.4 ns | |
| Number of Inputs | 76 | |
| Number of Outputs | 76 | |
| Number of Macro Cells | 440 | |
| Number of I/O Lines | 76 | |
| Programmable Logic Type | FLASH PLD | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 76 I/O | |
| Additional Feature | IT CAN ALSO OPERATE AT 3.3V | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 1.5/3.3,2.5/3.3 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFQFP | |
| Package Equivalence Code | TQFP100,.63SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | 16 X 16 MM, 0.50 MM PITCH, LEAD FREE, TQFP-100 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EPM570T100I3N Overview
The chip model EPM570T100I3N is a powerful tool with a wide range of applications. Developed by Altera Corporation, it is a member of the Stratix V family of FPGAs and is designed to meet the needs of high-performance, low-power applications. The model provides a high-speed, low-power, and reliable solution for a variety of applications, including networking, communications, multimedia, automotive, and industrial automation.
The chip model EPM570T100I3N has the capability to be used in advanced communication systems, and its original design intention is to provide a high-speed, low-power, and reliable solution for a variety of applications. It is also capable of being upgraded and adapted to meet the needs of changing technologies and applications. This makes it an ideal solution for applications that require high-performance, low-power solutions.
The chip model EPM570T100I3N can be used in a variety of networks, such as Wi-Fi, Ethernet, and cellular. It is also capable of being used in intelligent scenarios, such as machine learning and artificial intelligence. This makes it a powerful tool for applications that require the support of new technologies.
The chip model EPM570T100I3N is also capable of being used in the era of fully intelligent systems. With its advanced capabilities, it can be used to develop and deploy intelligent systems that can process large amounts of data and make decisions quickly and accurately. This makes it an ideal solution for applications that require high-performance, low-power solutions.
In conclusion, the chip model EPM570T100I3N is a powerful tool with a wide range of applications. With its advanced capabilities, it can be used to develop and deploy intelligent systems that can process large amounts of data and make decisions quickly and accurately. It is also capable of being upgraded and adapted to meet the needs of changing technologies and applications. This makes it an ideal solution for applications that require high-performance, low-power solutions.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||