EPM570F256I3
EPM570F256I3
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rohs

Altera Corporation

EPM570F256I3


EPM570F256I3
F53-EPM570F256I3
Active
FLASH PLD, 5.4 ns, 440-Cell, CMOS
QFP

EPM570F256I3 ECAD Model


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EPM570F256I3 Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Active
Propagation Delay 5.4 ns
Number of Inputs 160
Number of Outputs 160
Number of Macro Cells 440
Number of I/O Lines 160
Programmable Logic Type FLASH PLD
Package Shape SQUARE
Technology CMOS
Organization 0 DEDICATED INPUTS, 160 I/O
Additional Feature YES
Clock Frequency-Max 175.5 MHz
In-System Programmable YES
JTAG BST YES
Power Supplies 1.5/3.3,2.5/3.3 V
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Number of Terminals 256
Package Body Material PLASTIC
Package Code BGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Ihs Manufacturer INTEL CORP
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EPM570F256I3 Overview



The chip model EPM570F256I3 is a specialized chip model designed for embedded systems. It is a field programmable gate array (FPGA) designed to enable embedded systems to be more efficient and reliable. This chip model is the latest in a series of FPGAs from Altera, and is designed to be used in a wide range of applications, from automotive systems to medical devices. The chip model EPM570F256I3 is designed to be a powerful and flexible solution for embedded systems.


The chip model EPM570F256I3 has been designed to be used in a wide range of applications, including automotive, medical, industrial, and consumer electronics. It is designed to provide a high level of performance and reliability, while still being cost-effective. The chip model is also designed to be easily integrated into existing systems, and can be used in a variety of different scenarios.


The chip model EPM570F256I3 is designed to be used in a wide range of applications, and is capable of supporting a variety of different technologies. It is designed to be used in a wide range of intelligent systems, such as networks, intelligent robots, and other intelligent systems. It is also designed to be used in a wide range of applications, such as automotive, medical, industrial, and consumer electronics.


The chip model EPM570F256I3 is designed to be used in a wide range of applications, and is capable of supporting a variety of different technologies. It is designed to be used in a wide range of intelligent systems, such as networks, intelligent robots, and other intelligent systems. In order to use the chip model effectively, it is necessary to have a deep understanding of the technologies used in the chip model, and the ability to use them effectively. It is also necessary to have a good understanding of the application environment, and the requirements of the application.


The chip model EPM570F256I3 is designed to be used in a wide range of applications, and is capable of supporting a variety of different technologies. It is designed to be used in a wide range of intelligent systems, such as networks, intelligent robots, and other intelligent systems. In order to use the chip model effectively, it is necessary to have a deep understanding of the technologies used in the chip model, and the ability to use them effectively. It is also necessary to have a good understanding of the application environment, and the requirements of the application.


The chip model EPM570F256I3 is designed to be used in a wide range of applications and is capable of supporting a variety of different technologies. It is designed to be used in a wide range of intelligent systems, such as networks, intelligent robots, and other intelligent systems. In order to use the chip model effectively, it is necessary to have a deep understanding of the technologies used in the chip model, and the ability to use them effectively. It is also necessary to have a good understanding of the application environment, and the requirements of the application.


In order to use the chip model EPM570F256I3 effectively, it is necessary to have a good understanding of the industry trends of the chip model, and the future development of related industries. It is also necessary to understand what specific technologies are needed in order to use the chip model effectively, and whether the application environment requires the support of new technologies. Furthermore, it is important to understand the possible future applications of the chip model in networks and which intelligent scenarios it may be applied to, as well as whether it is possible to be used in the era of fully intelligent systems. Finally, it is important to understand whether the chip model can be applied to the development and popularization of future intelligent robots, and what technical talents are needed to use the model effectively.


Overall, the chip model EPM570F256I3 is a powerful and flexible solution for embedded systems, and is designed to be used in a wide range of applications. In order to use the chip model effectively, it is necessary to have a good understanding of the industry trends of the chip model, and the future development of related industries, as well as what specific technologies are needed in order to use the chip model effectively. Furthermore, it is important to understand the possible future applications of the chip model in networks and which intelligent scenarios it may be applied to, as well as whether it is possible to be used in the era of fully intelligent systems. Finally, it is important to understand whether the chip model can be applied to the development and popularization of future intelligent robots, and what technical talents are needed to use the model effectively.



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