Altera Corporation
EPM570F100I4N
EPM570F100I4N ECAD Model
EPM570F100I4N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 7 ns | |
| Number of Inputs | 76 | |
| Number of Outputs | 76 | |
| Number of Macro Cells | 440 | |
| Number of I/O Lines | 76 | |
| Programmable Logic Type | FLASH PLD | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 76 I/O | |
| Additional Feature | IT CAN ALSO OPERATE AT 3.3V | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 1.5/3.3,2.5/3.3 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA100,10X10,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 11 mm | |
| Length | 11 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | 11 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-100 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EPM570F100I4N Overview
The chip model EPM570F100I4N is a powerful and versatile tool for high-performance digital signal processing, embedded processing, image processing, and other related applications. As a Field Programmable Gate Array (FPGA) chip, it is programmed using HDL language and provides a wide range of features, including high-speed signal processing, flexible integration, and low power consumption.
The EPM570F100I4N chip model is designed to optimize performance and reduce cost. Its main advantage is its high-speed signal processing capability, which allows for faster processing of data. Additionally, the chip model is designed with a flexible integration system, allowing for a wide range of applications. Moreover, its low power consumption allows for more efficient use of energy and cost savings.
The expected demand for the EPM570F100I4N chip model is increasing in the related industries. This is due to its versatile features, which make it suitable for a wide range of applications. Its high-speed signal processing capability, flexible integration system, and low power consumption make it an ideal choice for applications such as medical imaging, autonomous vehicles, and machine learning.
The original design intention of the EPM570F100I4N chip model was to provide a powerful and cost-effective solution for high-performance digital signal processing, embedded processing, and image processing. The chip model can be upgraded in the future to meet the needs of more advanced communication systems. It is also possible to upgrade the chip model to support more powerful features, such as higher-speed signal processing or more flexible integration.
Overall, the EPM570F100I4N chip model is an ideal choice for high-performance digital signal processing, embedded processing, image processing, and other related applications. Its powerful features, including high-speed signal processing, flexible integration, and low power consumption, make it suitable for a wide range of applications. Additionally, the chip model can be upgraded in the future to meet the needs of more advanced communication systems. Therefore, the EPM570F100I4N chip model is expected to be in high demand in the related industries in the future.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||