Altera Corporation
EPM5130WM
EPM5130WM ECAD Model
EPM5130WM Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Propagation Delay | 55 ns | |
| Number of Dedicated Inputs | 19 | |
| Number of Macro Cells | 128 | |
| Number of I/O Lines | 64 | |
| Programmable Logic Type | UV PLD | |
| Temperature Grade | MILITARY | |
| Package Shape | RECTANGULAR | |
| Technology | CMOS | |
| Organization | 19 DEDICATED INPUTS, 64 I/O | |
| Additional Feature | LABS INTERCONNECTED BY PIA; 8 LABS; 128 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK... more | |
| Clock Frequency-Max | 33.3 MHz | |
| In-System Programmable | NO | |
| JTAG BST | NO | |
| Output Function | MACROCELL | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | R-CQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Number of Terminals | 100 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | WQFP | |
| Package Equivalence Code | QFP100,.7X.9 | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK, WINDOW | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 19.2 mm | |
| Seated Height-Max | 2.99 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | QFP | |
| Package Description | WQFP, QFP100,.7X.9 | |
| Pin Count | 100 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A001.A.2.C |
EPM5130WM Datasheet Download
EPM5130WM Overview
The EPM5130WM chip model is a powerful, versatile processor that is suitable for a variety of applications. It is an ideal choice for high-performance digital signal processing, embedded processing, and image processing. It is designed to be programmed in HDL language, which provides a flexible and efficient platform for developing complex applications.
The EPM5130WM chip model offers several advantages over its competitors. It provides a high level of performance, with a low-power consumption rate, and is capable of handling complex algorithms. Additionally, it is designed to be scalable, meaning that it can be upgraded to meet the needs of future applications. The model also supports a wide range of peripherals and interfaces, making it easy to integrate into existing systems.
The EPM5130WM chip model is expected to be in high demand in the future, as more applications are developed that require its capabilities. It is likely to be used in a variety of industries, including medical, automotive, and consumer electronics. In the networking field, the chip model is expected to be used in intelligent scenarios such as data analysis, machine learning, and artificial intelligence.
The EPM5130WM chip model is also likely to be used in the era of fully intelligent systems. It is capable of handling the complex algorithms and data processing needed for such systems. Additionally, its scalability makes it possible to upgrade the chip model to meet the changing needs of these intelligent systems. By utilizing the chip model, it is possible to create powerful and reliable intelligent systems that can be used in a variety of applications.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $91.8840 | $91.8840 |
| 10+ | $90.8960 | $908.9600 |
| 100+ | $85.9560 | $8,595.6000 |
| 1000+ | $81.0160 | $40,508.0000 |
| 10000+ | $74.1000 | $74,100.0000 |
| The price is for reference only, please refer to the actual quotation! | ||