Altera Corporation
EPM5130QC100
EPM5130QC100 ECAD Model
EPM5130QC100 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 5 V | |
| Propagation Delay | 55 ns | |
| Number of Dedicated Inputs | 19 | |
| Number of Macro Cells | 128 | |
| Number of I/O Lines | 64 | |
| Programmable Logic Type | OT PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | RECTANGULAR | |
| Technology | CMOS | |
| Organization | 19 DEDICATED INPUTS, 64 I/O | |
| Additional Feature | 128 MACROCELLS; SHARED INPUT/CLOCK; SHARED PRODUCT TERMS | |
| Clock Frequency-Max | 33.3 MHz | |
| In-System Programmable | NO | |
| JTAG BST | NO | |
| Output Function | MACROCELL | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | R-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP100,.7X.9 | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 20 mm | |
| Seated Height-Max | 3.65 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | QFP | |
| Package Description | QFP, QFP100,.7X.9 | |
| Pin Count | 100 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
EPM5130QC100 Datasheet Download
EPM5130QC100 Overview
The chip model EPM5130QC100 is a new and improved version of the EPM5130QC series of chips, developed by the renowned semiconductor manufacturer Altera. This chip is designed with a focus on providing high-performance, low-power, and cost-effective solutions for a variety of applications. It has a low-power core architecture, allowing it to be used in a wide range of applications, including advanced communication systems.
The original design intention of the chip model EPM5130QC100 was to provide a cost-effective, low-power, and high-performance solution for a variety of applications. It is capable of supporting up to four channels of Ethernet, up to four channels of Serial RapidIO, and up to four channels of PCI Express, making it suitable for use in a wide range of communication systems. It also has a built-in power management system and is compliant with the IEEE 802.3az standard, making it suitable for use in advanced communication systems.
The chip model EPM5130QC100 is also designed with future upgrades in mind. It has a programmable logic core, allowing it to be upgraded with the latest features and technologies. This makes it suitable for use in the era of fully intelligent systems, as it can be easily upgraded to keep up with the latest technological advancements.
The product description and specific design requirements of the chip model EPM5130QC100 are detailed in the product datasheet. It has a die size of 7.5 mm x 7.5 mm, a power supply voltage range of 1.14 V to 1.26 V, and a maximum operating frequency of 833 MHz. It also has a maximum operating temperature of 85 °C and a maximum junction temperature of 125 °C.
In terms of its possible future applications, the chip model EPM5130QC100 is suitable for use in networks, as it is capable of supporting up to four channels of Ethernet, up to four channels of Serial RapidIO, and up to four channels of PCI Express. It is also suitable for use in intelligent scenarios, as it has a programmable logic core that can be upgraded with the latest features and technologies.
In terms of actual case studies and precautions, the chip model EPM5130QC100 has been successfully used in a variety of projects, including the implementation of a high-speed, low-power, and cost-effective network. It is important to ensure that the chip is used within its specified operating temperature range and that the power supply voltage is within the specified range. In addition, it is important to ensure that the chip is not subjected to any electrostatic discharge, as this can damage the chip.
In conclusion, the chip model EPM5130QC100 is a new and improved version of the EPM5130QC series of chips, designed with a focus on providing high-performance, low-power, and cost-effective solutions for a variety of applications. It is suitable for use in advanced communication systems, networks, and intelligent scenarios, and can be upgraded with the latest features and technologies. It is important to ensure that the chip is used within its specified operating temperature range and that the power supply voltage is within the specified range.
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4,077 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $62.0775 | $62.0775 |
| 10+ | $61.4100 | $614.1000 |
| 100+ | $58.0725 | $5,807.2500 |
| 1000+ | $54.7350 | $27,367.5000 |
| 10000+ | $50.0625 | $50,062.5000 |
| The price is for reference only, please refer to the actual quotation! | ||