EPM3256AFC256-10N
EPM3256AFC256-10N
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rohs

Altera Corporation

EPM3256AFC256-10N


EPM3256AFC256-10N
F53-EPM3256AFC256-10N
Active
EE PLD, 10 ns, CMOS, BGA,
-

EPM3256AFC256-10N ECAD Model


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EPM3256AFC256-10N Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 3.3 V
Propagation Delay 10 ns
Number of I/O Lines 161
Programmable Logic Type EE PLD
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 0 DEDICATED INPUTS, 161 I/O
Output Function MACROCELL
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer INTEL CORP
Package Description BGA,
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EPM3256AFC256-10N Overview



The chip model EPM3256AFC256-10N is a powerful and highly advanced chip that is designed for use in a variety of applications. It is designed to be used in a wide range of communication systems, from traditional wired networks to modern wireless networks. It also has the ability to be used in intelligent systems and scenarios, allowing for a wide range of potential applications.


The chip model EPM3256AFC256-10N is designed to be highly reliable and efficient. It is designed to be able to handle large amounts of data and provide high-speed communication. It is also designed to be able to handle a wide range of different technologies, including new and emerging technologies. This makes it an ideal choice for a wide range of applications.


The chip model EPM3256AFC256-10N is designed to be highly scalable and upgradable. This allows it to be used in a variety of different applications and scenarios. It is also designed to be able to handle a variety of different technologies, including new and emerging technologies. This makes it an ideal choice for a wide range of applications and scenarios.


The chip model EPM3256AFC256-10N is designed to be highly reliable and efficient. It is designed to be able to handle large amounts of data and provide high-speed communication. It is also designed to be able to handle a wide range of different technologies, including new and emerging technologies. This makes it an ideal choice for a wide range of applications, including advanced communication systems.


The chip model EPM3256AFC256-10N is also designed to be able to handle a wide range of intelligent scenarios and applications. This makes it an ideal choice for use in the era of fully intelligent systems. It is designed to be able to handle a variety of different technologies, including new and emerging technologies. This makes it an ideal choice for a wide range of applications and scenarios.


In conclusion, the chip model EPM3256AFC256-10N is a highly advanced chip that is designed for use in a variety of applications. It is designed to be highly reliable and efficient, and is designed to be able to handle a wide range of different technologies, including new and emerging technologies. It is also designed to be highly scalable and upgradable, allowing it to be used in a variety of different applications and scenarios. It is also designed to be able to handle a wide range of intelligent scenarios and applications, making it an ideal choice for use in the era of fully intelligent systems.



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