Altera Corporation
EPM2210F256I3N
EPM2210F256I3N ECAD Model
EPM2210F256I3N Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 7 ns | |
| Number of Macro Cells | 1700 | |
| Number of I/O Lines | 204 | |
| Programmable Logic Type | FLASH PLD | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 204 I/O | |
| Additional Feature | IT CAN ALSO OPERATE AT 3.3V | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 1.5/3.3,2.5/3.3 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2.2 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | BGA, BGA256,16X16,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Pin Count | 256 | |
| ECCN Code | 3A991.D |
EPM2210F256I3N Datasheet Download
EPM2210F256I3N Overview
The chip model EPM2210F256I3N is a high-performance device that is suitable for digital signal processing, embedded processing, image processing, and other applications. It is designed to be used with the HDL language, which is a hardware description language that allows for the creation of complex digital designs. This chip model is capable of providing high-speed operation and is suitable for applications that require high-speed processing.
The chip model EPM2210F256I3N is designed to meet the industry trends and is suitable for use in a wide range of applications. It is capable of providing the necessary performance and features that are needed for the current applications. As the industry continues to evolve, the chip model will need to be upgraded to keep up with the latest technologies and trends.
The original design intention of the chip model EPM2210F256I3N was to provide a high-performance and reliable device that could be used in a variety of applications. The chip model is capable of providing the necessary performance and features that are needed for the current applications. It is also capable of being upgraded in the future to support new technologies. This makes it suitable for use in advanced communication systems.
The chip model is capable of providing the necessary performance and features that are needed for the current applications. It is also capable of being upgraded in the future to support new technologies. This makes it suitable for use in advanced communication systems. The chip model is designed to be flexible and can be used in a variety of applications. It is also capable of providing the necessary performance and features that are needed for the current applications.
The chip model EPM2210F256I3N is a high-performance device that is suitable for digital signal processing, embedded processing, image processing, and other applications. It is designed to be used with the HDL language, which is a hardware description language that allows for the creation of complex digital designs. This chip model is capable of providing high-speed operation and is suitable for applications that require high-speed processing. It is also capable of being upgraded in the future to support new technologies. This makes it suitable for use in advanced communication systems and other applications. The chip model is designed to meet the industry trends and is suitable for use in a wide range of applications. It is capable of providing the necessary performance and features that are needed for the current applications. As the industry continues to evolve, the chip model will need to be upgraded to keep up with the latest technologies and trends.
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3,520 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $66.9600 | $66.9600 |
| 10+ | $66.2400 | $662.4000 |
| 100+ | $62.6400 | $6,264.0000 |
| 1000+ | $59.0400 | $29,520.0000 |
| 10000+ | $54.0000 | $54,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||