Altera Corporation
EPM2210F256I3
EPM2210F256I3 ECAD Model
EPM2210F256I3 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 7 ns | |
| Number of Inputs | 204 | |
| Number of Outputs | 204 | |
| Number of Macro Cells | 1700 | |
| Number of I/O Lines | 204 | |
| Programmable Logic Type | FLASH PLD | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 204 I/O | |
| Additional Feature | YES | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 1.5/3.3,2.5/3.3 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
EPM2210F256I3 Overview
The chip model EPM2210F256I3 is a high-performance, low-power field-programmable gate array (FPGA) designed for digital signal processing, embedded processing, and image processing applications. It has a wide range of applications, from consumer and industrial electronics to communications, aerospace, and military. The chip model is based on the Altera Max EPM2210 family, and it is programmed using the Hardware Description Language (HDL) to customize its functions and features.
The chip model EPM2210F256I3 is designed to provide high-performance and low-power solutions for a wide range of applications. It is capable of performing complex operations at high speeds, such as digital signal processing, embedded processing, and image processing. The chip model is also designed to be easily upgradable, allowing users to take advantage of new technologies and features as they become available.
The chip model EPM2210F256I3 is designed to be used in a variety of applications, including consumer electronics, industrial electronics, communications, aerospace, and military. It is designed to be used in advanced communication systems, such as 5G and 6G, and can be used for a wide range of tasks, from data processing to image processing. The chip model is also designed to be easily upgradable, allowing users to take advantage of new technologies and features as they become available.
The chip model EPM2210F256I3 is a powerful and versatile FPGA that can support a wide range of applications. Its original design intention was to provide a high-performance, low-power solution for a wide range of applications. It is capable of performing complex operations at high speeds, such as digital signal processing, embedded processing, and image processing. The chip model is also designed to be easily upgradable, allowing users to take advantage of new technologies and features as they become available.
The chip model EPM2210F256I3 is designed to be used in a variety of applications, including consumer electronics, industrial electronics, communications, aerospace, and military. It is designed to be used in advanced communication systems, such as 5G and 6G, and can be used for a wide range of tasks, from data processing to image processing. The chip model is also designed to be easily upgradable, allowing users to take advantage of new technologies and features as they become available.
In conclusion, the chip model EPM2210F256I3 is a powerful and versatile FPGA that is capable of performing complex operations at high speeds. It is designed to be used in a variety of applications, including consumer electronics, industrial electronics, communications, aerospace, and military. It is also designed to be easily upgradable, allowing users to take advantage of new technologies and features as they become available. The chip model is an ideal solution for high-performance digital signal processing, embedded processing, and image processing applications.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||