Altera Corporation
EPM1270T144I3N
EPM1270T144I3N ECAD Model
EPM1270T144I3N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 6.2 ns | |
| Number of Inputs | 116 | |
| Number of Outputs | 116 | |
| Number of Macro Cells | 980 | |
| Number of I/O Lines | 116 | |
| Programmable Logic Type | FLASH PLD | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 116 I/O | |
| Additional Feature | IT CAN ALSO OPERATE AT 3.3V | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 1.5/3.3,2.5/3.3 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP144,.87SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | 22 X 22 MM, 0.50 MM PITCH, LEAD FREE, TQFP-144 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EPM1270T144I3N Overview
The chip model EPM1270T144I3N is a powerful integrated circuit designed for high-performance digital signal processing, embedded processing, image processing, and other related applications. To use this chip, one must be proficient in HDL language, as this chip was designed to be used with the help of such a language.
The original design intention of the chip model EPM1270T144I3N was to provide a powerful, reliable, and efficient platform for digital signal processing, embedded processing, and image processing applications. With its highly advanced features and capabilities, this chip can easily handle the most complex of tasks. Furthermore, the chip can be upgraded and expanded to meet the needs of more complex tasks.
The chip model EPM1270T144I3N has a wide range of applications in networks and communication systems. It can be used to process large amounts of data quickly and efficiently. It can also be used to develop advanced communication systems, such as those used in the internet of things. Moreover, the chip can be used in intelligent scenarios, such as autonomous vehicles, self-driving robots, and more.
The chip model EPM1270T144I3N is also suitable for use in the era of fully intelligent systems. With its advanced features, it can be used to develop systems that can learn, think, and react to their environment. This chip can be used to develop systems that can understand natural language, recognize patterns, and make decisions. Furthermore, it can be used to develop systems that can interact with humans and other machines.
In conclusion, the chip model EPM1270T144I3N is a powerful integrated circuit designed for a wide range of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and more. It can also be used to develop advanced communication systems and intelligent scenarios. Furthermore, it can be used in the era of fully intelligent systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||