Altera Corporation
EPM1270GF256I4N
EPM1270GF256I4N ECAD Model
EPM1270GF256I4N Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 1.8 V | |
| Propagation Delay | 8.1 ns | |
| Number of Macro Cells | 980 | |
| Number of I/O Lines | 212 | |
| Programmable Logic Type | FLASH PLD | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 212 I/O | |
| Additional Feature | IT CAN ALSO OPERATE AT 3.3V | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 1.5/3.3,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2.2 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA256,16X16,40 | |
| Pin Count | 256 |
EPM1270GF256I4N Datasheet Download
EPM1270GF256I4N Overview
The EPM1270GF256I4N chip model is a highly versatile and powerful model that can be used for a wide range of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. With its powerful capabilities, this chip model is becoming increasingly popular in the industry.
The future development of the chip model EPM1270GF256I4N is expected to be driven by the industry trends, such as the emergence of new technologies and the increasing demand for intelligent systems. As such, it is likely that the chip model will be used in networks, as well as in intelligent scenarios. It may even be used in fully intelligent systems, as the chip model is capable of processing large amounts of data quickly and accurately.
The EPM1270GF256I4N chip model is expected to be used in a variety of industries, including automotive, medical, aerospace, and consumer electronics. Its ability to process data quickly and accurately makes it an ideal choice for these industries. With its powerful capabilities, this chip model is expected to be used in a variety of applications, from image processing to embedded processing.
The EPM1270GF256I4N chip model is a powerful and versatile model that is expected to be used in a variety of industries and applications. Its ability to process data quickly and accurately makes it a great choice for applications that require high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. As the industry trends continue to evolve, it is likely that the chip model will be used in a variety of scenarios, from networks to intelligent systems. With its powerful capabilities, the chip model is expected to be a key component in the era of fully intelligent systems.
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5,112 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $59.5800 | $59.5800 |
| 10+ | $58.9393 | $589.3934 |
| 100+ | $55.7361 | $5,573.6115 |
| 1000+ | $52.5329 | $26,266.4450 |
| 10000+ | $48.0484 | $48,048.3750 |
| The price is for reference only, please refer to the actual quotation! | ||