Altera Corporation
EPM1270F256I3N
EPM1270F256I3N ECAD Model
EPM1270F256I3N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 6.2 ns | |
| Number of Inputs | 212 | |
| Number of Outputs | 212 | |
| Number of Macro Cells | 980 | |
| Number of I/O Lines | 212 | |
| Programmable Logic Type | FLASH PLD | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 212 I/O | |
| Additional Feature | IT CAN ALSO OPERATE AT 3.3V | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 1.5/3.3,2.5/3.3 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2.2 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | 17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
EPM1270F256I3N Overview
The chip model EPM1270F256I3N is a high-performance digital signal processor with embedded processing and image processing capabilities. It is designed to be programmed with HDL, a hardware description language, and is suitable for a variety of applications.
The industry trends of the chip model EPM1270F256I3N are constantly evolving and developing. As technology advances, new technologies and applications are being developed that require the support of the chip model. In order to stay ahead of the competition, companies must be prepared to adapt to these changes.
The chip model EPM1270F256I3N can be used in the development and popularization of future intelligent robots. It is capable of performing complex tasks quickly and efficiently, and its programming language makes it easy to customize the robot for specific tasks. In order to use the model effectively, technical talent is required, such as engineers and programmers who are knowledgeable in the HDL language and robotics.
In conclusion, the chip model EPM1270F256I3N is a powerful tool for a variety of applications, from high-performance digital signal processing to embedded processing and image processing. It is constantly evolving and developing, and is capable of being used in the development and popularization of future intelligent robots. In order to use the model effectively, technical talent is required such as engineers and programmers who are knowledgeable in the HDL language and robotics.
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2,133 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||