Altera Corporation
EPM1270F256I3
EPM1270F256I3 ECAD Model
EPM1270F256I3 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 6.2 ns | |
| Number of Inputs | 212 | |
| Number of Outputs | 212 | |
| Number of Macro Cells | 980 | |
| Number of I/O Lines | 212 | |
| Programmable Logic Type | FLASH PLD | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 212 I/O | |
| Additional Feature | YES | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 1.5/3.3,2.5/3.3 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
EPM1270F256I3 Overview
The chip model EPM1270F256I3 is a high-performance device that is suitable for digital signal processing, embedded processing, and image processing. It requires the use of HDL (Hardware Description Language) for programming. This chip can be applied to a wide range of industries, such as automotive, aerospace, industrial, medical, and consumer electronics.
The industry trends of the chip model EPM1270F256I3 are constantly changing and evolving. As new technologies become available, the chip can be used in more advanced applications and scenarios. For example, the chip can be used in networks to process large amounts of data quickly and efficiently. It can also be used in intelligent scenarios, such as voice recognition or facial recognition. In the future, it may even be used in fully intelligent systems, such as self-driving cars or robots.
The chip model EPM1270F256I3 has the potential to revolutionize the way we interact with technology. It can be used to create faster, more efficient, and more reliable systems. With its powerful processing capabilities, it can be used in a variety of applications, from embedded systems to advanced artificial intelligence. This chip is a great choice for anyone looking to create powerful and reliable systems.
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5,267 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||