Altera Corporation
EPF8452AGC160-6
EPF8452AGC160-6 ECAD Model
EPF8452AGC160-6 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 120 | |
| Number of Outputs | 116 | |
| Number of Logic Cells | 336 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 116 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 116 I/O | |
| Additional Feature | 452 FLIP FLOPS; 336 LOGIC ELEMENTS; CONFIGURABLE I/O OPERATION (3.3V OR 5V) | |
| Output Function | REGISTERED | |
| Power Supplies | 3.3/5,5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-CPGA-P160 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 1 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Number of Terminals | 160 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | PGA | |
| Package Equivalence Code | PGA160M,15X15 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | NO | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 39.624 mm | |
| Length | 39.624 mm | |
| Seated Height-Max | 5.34 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | PGA | |
| Package Description | PGA, PGA160M,15X15 | |
| Pin Count | 160 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
EPF8452AGC160-6 Datasheet Download
EPF8452AGC160-6 Overview
The chip model EPF8452AGC160-6 is a high-performance digital signal processing (DSP) device that is suitable for embedded processing, image processing, and other applications. It requires the use of HDL (Hardware Description Language) to program and configure the chip. This chip model is leading the way in the industry as it is designed to be able to handle increasingly complex tasks and provide superior performance.
The EPF8452AGC160-6 chip model is a great choice for applications that require high-performance DSP. It is capable of handling complex tasks such as image processing, embedded processing, and other tasks that require a high level of precision. As the demand for more powerful and efficient DSP technology increases, the EPF8452AGC160-6 chip model is an ideal choice for many applications.
In terms of future development and industry trends, the EPF8452AGC160-6 chip model is likely to be used in networks and intelligent scenarios. As the world moves towards a more connected and intelligent future, the chip model is likely to be used to power many of the systems and devices that will be used in the era of fully intelligent systems. It is also possible that the chip model will be used to power new technologies, such as artificial intelligence, machine learning, and 5G networks.
The EPF8452AGC160-6 chip model is a great choice for applications that require high-performance DSP. It is capable of handling complex tasks and providing superior performance, making it a great choice for many applications. As the demand for more powerful and efficient DSP technology increases, the EPF8452AGC160-6 chip model is likely to be used in networks and intelligent scenarios in the future. Furthermore, it is possible that the chip model will be used to power new technologies, such as artificial intelligence, machine learning, and 5G networks.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||