EPF81500ARI240-3
EPF81500ARI240-3
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rohs

Altera Corporation

EPF81500ARI240-3


EPF81500ARI240-3
F53-EPF81500ARI240-3
Active
LOADABLE PLD, 1.8 ns, CMOS, FQFP, HQFP240,1.37SQ,20
FQFP, HQFP240,1.37SQ,20

EPF81500ARI240-3 ECAD Model


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EPF81500ARI240-3 Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 5 V
Propagation Delay 1.8 ns
Number of Inputs 181
Number of Outputs 177
Number of Logic Cells 1296
Number of Dedicated Inputs 4
Number of I/O Lines 181
Programmable Logic Type LOADABLE PLD
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology CMOS
Organization 4 DEDICATED INPUTS, 181 I/O
Additional Feature 1296 LOGIC ELEMENTS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
Clock Frequency-Max 385 MHz
Output Function REGISTERED
Power Supplies 3.3/5,5 V
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
JESD-30 Code S-PQFP-G240
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 220
Number of Terminals 240
Package Body Material PLASTIC/EPOXY
Package Code FQFP
Package Equivalence Code HQFP240,1.37SQ,20
Package Shape SQUARE
Package Style FLATPACK, FINE PITCH
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form GULL WING
Terminal Pitch 500 µm
Terminal Position QUAD
Width 32 mm
Length 32 mm
Seated Height-Max 4.1 mm
Ihs Manufacturer ALTERA CORP
Part Package Code QFP
Package Description FQFP, HQFP240,1.37SQ,20
Pin Count 240
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EPF81500ARI240-3 Datasheet Download


EPF81500ARI240-3 Overview



The chip model EPF81500ARI240-3 is a powerful and reliable model that has been widely adopted in many industries. It is a low-power, high-performance integrated circuit (IC) that is designed to provide a variety of functions. The model is suitable for a wide range of applications, such as embedded systems, automotive, industrial, medical, and consumer electronics.


The EPF81500ARI240-3 is a highly integrated system-on-chip (SoC) that integrates a variety of components, including a CPU, memory, and peripherals. It is designed to provide flexibility and scalability to meet the needs of different applications. The model is also designed to be low power and energy efficient. It is capable of running at low voltage and consuming minimal power.


In terms of industry trends, the EPF81500ARI240-3 is expected to continue to be widely adopted in the coming years. The model is well suited for a variety of applications and its low power consumption makes it attractive for use in the Internet of Things (IoT) and other connected devices. The model is also expected to be used in a variety of other applications, such as automotive, industrial, medical, and consumer electronics.


In terms of future applications, the EPF81500ARI240-3 is expected to be used in a variety of networks, such as 5G, Wi-Fi, and Bluetooth. It is also expected to be used in intelligent scenarios, such as smart homes and smart cities. The model is expected to be used in the era of fully intelligent systems, such as artificial intelligence (AI), machine learning (ML), and robotics.


The EPF81500ARI240-3 is expected to be widely adopted in the coming years, as it is well suited for a variety of applications. Its low power consumption and flexibility make it attractive for use in IoT and other connected devices. The model is also expected to be used in a variety of networks and intelligent scenarios, such as smart homes and smart cities, and is expected to be used in the era of fully intelligent systems. The demand for the model is expected to increase in the coming years and it is likely that new technologies will be needed to support its application environment.



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