
Altera Corporation
EPF81500ARI240-3
EPF81500ARI240-3 ECAD Model
EPF81500ARI240-3 Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Propagation Delay | 1.8 ns | |
Number of Inputs | 181 | |
Number of Outputs | 177 | |
Number of Logic Cells | 1296 | |
Number of Dedicated Inputs | 4 | |
Number of I/O Lines | 181 | |
Programmable Logic Type | LOADABLE PLD | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 4 DEDICATED INPUTS, 181 I/O | |
Additional Feature | 1296 LOGIC ELEMENTS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | |
Clock Frequency-Max | 385 MHz | |
Output Function | REGISTERED | |
Power Supplies | 3.3/5,5 V | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 4.5 V | |
JESD-30 Code | S-PQFP-G240 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 220 | |
Number of Terminals | 240 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FQFP | |
Package Equivalence Code | HQFP240,1.37SQ,20 | |
Package Shape | SQUARE | |
Package Style | FLATPACK, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | GULL WING | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Width | 32 mm | |
Length | 32 mm | |
Seated Height-Max | 4.1 mm | |
Ihs Manufacturer | ALTERA CORP | |
Part Package Code | QFP | |
Package Description | FQFP, HQFP240,1.37SQ,20 | |
Pin Count | 240 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
EPF81500ARI240-3 Datasheet Download
EPF81500ARI240-3 Overview
The chip model EPF81500ARI240-3 is a powerful and reliable model that has been widely adopted in many industries. It is a low-power, high-performance integrated circuit (IC) that is designed to provide a variety of functions. The model is suitable for a wide range of applications, such as embedded systems, automotive, industrial, medical, and consumer electronics.
The EPF81500ARI240-3 is a highly integrated system-on-chip (SoC) that integrates a variety of components, including a CPU, memory, and peripherals. It is designed to provide flexibility and scalability to meet the needs of different applications. The model is also designed to be low power and energy efficient. It is capable of running at low voltage and consuming minimal power.
In terms of industry trends, the EPF81500ARI240-3 is expected to continue to be widely adopted in the coming years. The model is well suited for a variety of applications and its low power consumption makes it attractive for use in the Internet of Things (IoT) and other connected devices. The model is also expected to be used in a variety of other applications, such as automotive, industrial, medical, and consumer electronics.
In terms of future applications, the EPF81500ARI240-3 is expected to be used in a variety of networks, such as 5G, Wi-Fi, and Bluetooth. It is also expected to be used in intelligent scenarios, such as smart homes and smart cities. The model is expected to be used in the era of fully intelligent systems, such as artificial intelligence (AI), machine learning (ML), and robotics.
The EPF81500ARI240-3 is expected to be widely adopted in the coming years, as it is well suited for a variety of applications. Its low power consumption and flexibility make it attractive for use in IoT and other connected devices. The model is also expected to be used in a variety of networks and intelligent scenarios, such as smart homes and smart cities, and is expected to be used in the era of fully intelligent systems. The demand for the model is expected to increase in the coming years and it is likely that new technologies will be needed to support its application environment.
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Pricing (USD)
QTY | Unit Price | Ext Price |
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