Altera Corporation
EPF81500AQI240-3
EPF81500AQI240-3 ECAD Model
EPF81500AQI240-3 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Propagation Delay | 1.8 ns | |
| Number of Inputs | 181 | |
| Number of Outputs | 177 | |
| Number of Logic Cells | 1296 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 181 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 181 I/O | |
| Additional Feature | CAN ALSO OPERATE AT 5V SUPPLY | |
| Output Function | REGISTERED | |
| Power Supplies | 3.3/5,5 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP240,1.3SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | QFP | |
| Package Description | FQFP, QFP240,1.3SQ,20 | |
| Pin Count | 240 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EPF81500AQI240-3 Datasheet Download
EPF81500AQI240-3 Overview
The chip model EPF81500AQI240-3 is a high-performance and cost-effective FPGA chip, developed by Altera. It is mainly used in high-speed communication systems and provides a wide range of features and functions. This chip model is designed with a flexible architecture and can be easily adapted to different application requirements. It is also equipped with an advanced power management system, which can reduce power consumption and extend the life of the chip.
The chip model EPF81500AQI240-3 has a number of advantages over other chip models, such as its flexibility in terms of design, its high performance and cost-effectiveness. It also has a wide range of features and functions, which make it suitable for a variety of applications. This chip model is also suitable for advanced communication systems, due to its advanced power management system and its ability to be easily upgraded.
In terms of its future development, the chip model EPF81500AQI240-3 is expected to be widely used in the industry. The demand for this chip model is expected to grow in the coming years, due to its advantages and features. It is also expected to be used in more advanced communication systems, due to its flexibility and power management system.
The original design intention of the chip model EPF81500AQI240-3 was to provide a cost-effective and high-performance FPGA chip for high-speed communication systems. It has been designed with a flexible architecture, so that it can be easily adapted to different application requirements. It is also equipped with an advanced power management system, which can reduce power consumption and extend the life of the chip.
It is also possible to upgrade the chip model EPF81500AQI240-3 in the future, in order to meet the changing needs of the industry. This could involve adding new features and functions, as well as improving the existing ones. It is also possible to upgrade the chip model in order to make it suitable for more advanced communication systems.
In conclusion, the chip model EPF81500AQI240-3 is a high-performance and cost-effective FPGA chip, which is suitable for a variety of applications. It has a flexible architecture and an advanced power management system, which makes it suitable for advanced communication systems. It is also possible to upgrade the chip model in the future, in order to meet the changing needs of the industry. The demand for this chip model is expected to grow in the coming years, due to its advantages and features.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
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