EPF6024ABC256-3N
EPF6024ABC256-3N
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rohs

Altera Corporation

EPF6024ABC256-3N


EPF6024ABC256-3N
F53-EPF6024ABC256-3N
Active
LOADABLE PLD, BGA
BGA

EPF6024ABC256-3N ECAD Model


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EPF6024ABC256-3N Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred
Supply Voltage-Nom 3.3 V
Number of Dedicated Inputs 4
Number of I/O Lines 218
Programmable Logic Type LOADABLE PLD
Temperature Grade OTHER
Package Shape SQUARE
Organization 4 DEDICATED INPUTS, 218 I/O
Additional Feature CAN ALSO BE USED 24000 LOGIC GATES
Clock Frequency-Max 133 MHz
Output Function MACROCELL
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e1
Operating Temperature-Max 85 °C
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.3 mm
Ihs Manufacturer ALTERA CORP
Part Package Code BGA
Package Description BGA,
Pin Count 256
Reach Compliance Code compliant
HTS Code 8542.39.00.01
ECCN Code 3A991.D

EPF6024ABC256-3N Datasheet Download


EPF6024ABC256-3N Overview



The chip model EPF6024ABC256-3N has been a major player in the industry for some time now, and its future development is of great interest to many. It is a powerful and versatile tool that can be used for a variety of applications, from networking to robotics. In order to determine what the future holds for this model, we must first consider the current industry trends and the possible applications for the chip.


The industry trends of the EPF6024ABC256-3N chip model include the increasing demand for high-performance integrated circuits and the need for low-cost solutions. This chip model has the potential to meet both of these needs, as it can be used to create powerful, yet cost-effective solutions. The chip model is also well-suited for use in a variety of applications, including networking, intelligent systems, and robotics.


As for the future development of the EPF6024ABC256-3N chip model, it is likely that it will continue to be used in many of the same applications that it is currently used for. Networks are likely to remain a major area of use for the chip model, as it can be used to create powerful and efficient networks. The chip model is also likely to be used in the development and popularization of intelligent systems and robots, as it can provide the necessary processing power and intelligence to enable these systems to function.


In order to effectively use the EPF6024ABC256-3N chip model, certain technical talents are needed. These include knowledge of programming languages, hardware design, and software engineering. Knowledge of these topics is essential for creating powerful and efficient solutions that utilize the EPF6024ABC256-3N chip model. Additionally, knowledge of the chip model itself is also necessary, as it is important to understand how the chip works and how it can be used to create powerful and efficient solutions.


Overall, the EPF6024ABC256-3N chip model has the potential to be a major player in the industry for many years to come. It is a powerful and versatile tool that can be used to create powerful and efficient solutions. It is likely to remain a major player in the industry, as it is well-suited for use in a variety of applications, including networking, intelligent systems, and robotics. In order to effectively use the chip model, certain technical talents are needed, including knowledge of programming languages, hardware design, and software engineering. With the right knowledge and skills, the EPF6024ABC256-3N chip model can be used to create powerful and efficient solutions for many years to come.



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